Director, Memory Interface Marketing & Ecosystem

Rambus; San Jose (CA); Hybrid; USD 187,000 - 348,000; Full time

Benefits offered by this job

Hybrid work model

Competitive compensation package

Job summary

Rambus is seeking an experienced Director of Technical Marketing to bridge customers, ecosystem partners, engineering, and product teams for memory interface chip solutions.

The role focuses on technical product positioning, requirements, and ecosystem engagement across DDR6, MRDIMM, and related memory architectures, collaborating with Rambus’ Memory Interface Chips BU Marketing & BD teams.

Qualifications

• Bachelor's degree in Electrical Engineering, Computer Engineering or related technical field; advanced degree preferred.
• 12+ years in semiconductors with memory subsystems, server architectures, or memory modules.
• Strong knowledge of DDR5/DDR6, RDIMM, MRDIMM and memory ecosystems.
• Experience with processor vendors, SoC firms, DRAM suppliers, OEMs/ODMs and hyperscalers.
• Ability to translate technical requirements into product marketing collateral and customer communications.

Responsibilities

• Develop PRDs for memory interface chip products throughout the lifecycle.
• Author, edit, and publish technical collateral (datasheets, white papers, notes, presentations).
• Serve as the primary technical interface to processor vendors and ecosystem partners.
• Lead ecosystem enablement activities and qualification milestones.
• Collaborate with engineering, product management, sales, and partners on technical strategy.

Skills

Memory subsystems

Technical marketing

Ecosystem partnerships

JEDEC standards

Public speaking

Education

Bachelor's in Electrical/Computer Engineering

Tools

PRD development tools

AI-assisted content tools

Datasheet authoring

Job description

Rambus is seeking an experienced Director of Technical Marketing to bridge customers, ecosystem partners, engineering, and product teams for memory interface chip solutions.

The role focuses on technical product positioning, requirements, and ecosystem engagement across DDR6, MRDIMM, and related memory architectures, collaborating with Rambus’ Memory Interface Chips BU Marketing & BD teams.