Director, Chiplets Packaging Strategy & Programs

Semiconductor Engineering; Tempe (AZ); Hybrid; USD 110,000 - 150,000; Full time

Job summary

Amkor seeks an experienced BU Product Manager for Advanced Chiplets/FCBGA packaging in Tempe, AZ. The role centers on program management and core customer account leadership, coordinating internal teams and supplier development to qualify and ramp production.

You will drive process development and cost analysis for NPIs while supporting existing customers. The ideal candidate has a strong background in semiconductor packaging, DOE/SPC experience, and proven project management skills, with the

Qualifications

• Bachelor’s degree in Engineering (Mechanical, Chemical, Electrical, Industrial, Materials Science or other relevant disciplines).
• 10+ years of demonstrated industry experience required, with semiconductor packaging experience required.
• Experience with Design of Experiments and Statistical Process Control is needed.
• Previous project management experience is a required.
• Knowledge of material and package characterization data analysis, test methods and qualification procedures are required.
• Strong understanding of wafer bump, fanout, assembly processes and techniques is necessary.
• Experience with cost modeling, pricing, quoting activities and products is needed.
• Proven ability to multiplex across numerous programs and teams is essential.

Responsibilities

• Partner with BU members to achieve annual goals, while managing customer relationships to grow market share.
• Promote Amkor package technologies directly to new and existing customers to find potential applications, deploying the flip chip package portfolio with key customers to gain business.
• Work closely with customer teams to understand the assembly, reliability and scheduling requirements for various new package configurations and product introductions.
• Create detailed package/process risk assessments for the manufacturability and reliability of NPIs, including highlighting areas of customer requirements that drive cost and implementing mitigation plans to control them.
• Work closely with customer package engineering and Amkor factory engineering to understand/characterize prototype build plans; enabling successful qualifications and robust, on-time manufacturing production ramps.
• Create and maintain detailed cost analysis on package types, process flows, and customer product RFQs as well as provide detailed pricing inputs to Management and Sales on customer package engineering programs.
• Work with Amkor advanced product development teams on the transfer of new packaging technologies to production.
• Work within the team to foster the development of product roadmaps, marketing strategies and business plans for continued growth in both existing and emerging markets.

Skills

Program management

Key account management

Customer relations

Semiconductor packaging

Cross-functional leadership

Microsoft Office

Design of Experiments

Statistical Process Control

Project management

Education

Bachelor’s degree in Engineering

Master’s degree is a plus

Tools

MS Office

Job description

Amkor seeks an experienced BU Product Manager for Advanced Chiplets/FCBGA packaging in Tempe, AZ. The role centers on program management and core customer account leadership, coordinating internal teams and supplier development to qualify and ramp production.

You will drive process development and cost analysis for NPIs while supporting existing customers. The ideal candidate has a strong background in semiconductor packaging, DOE/SPC experience, and proven project management skills, with the