Senior Director, Advanced Packaging & Wafer Tech

Amkor Technology; Tempe (AZ); Hybrid; USD 240,000 - 350,000; Full time

Job summary

Amkor Technology in Tempe, AZ seeks a senior Director of Advanced Packaging and Wafer Services to lead development and commercialization of wafer-based IC package platforms, including HDFO, 2.5D, and chiplet architectures for computing, networking, AI and mobile markets.

The role combines strategic leadership with hands-on program management, guiding cross-functional teams across global R&D and customer engagements to transition technologies from development to production ramp.

Qualifications

• Bachelor's degree in Engineering required; Master's degree or Ph.D. preferred.
• 10+ years of experience in semiconductor package development, wafer-level packaging, IC packaging, or wafer process technology.
• Demonstrated leadership in advanced packaging development programs with direct customer engagement.
• Strong technical understanding of IC package architecture, design environments, wafer process integration, and manufacturability.

Responsibilities

• Lead strategic customer engagements with Tier 1 customers, aligning requirements with Amkor's technology roadmap.
• Drive and coordinate development activities with R&D teams globally to ensure timely execution of advanced package programs.
• Serve as the senior technical and program interface for customer meetings, reviews, and follow-up actions during development and qualification.
• Lead cross-functional teams across R&D, design, characterization, simulation, process engineering, product management, operations, and suppliers to execute complex programs.
• Own customer product management through concept definition, feasibility assessment, development, qualification, and initial production ramp.
• Guide technical tradeoff decisions related to package architecture, wafer process integration, design rules, materials, reliability, cost, schedule, and yield risk.
• Lead engagements with ecosystem partners and wafer processing suppliers to influence technology choices and future roadmap direction.

Job description

Amkor Technology in Tempe, AZ seeks a senior Director of Advanced Packaging and Wafer Services to lead development and commercialization of wafer-based IC package platforms, including HDFO, 2.5D, and chiplet architectures for computing, networking, AI and mobile markets.

The role combines strategic leadership with hands-on program management, guiding cross-functional teams across global R&D and customer engagements to transition technologies from development to production ramp.