Director, Chiplets/FCBGA BU

Amkor Technology, Inc.; Phoenix (AZ); Hybrid; USD 120,000 - 150,000; Full time

Job summary

Amkor Technology, Inc. is seeking a Business Unit Product Manager for Advanced Chiplets/FCBGA Packaging in Tempe, AZ. The role will focus on program management, key customer accounts, and driving internal process development. Candidates should have extensive experience in semiconductor packaging and excellent communication skills.

This position offers a hybrid work schedule and requires a Bachelor's degree in Engineering, with 10+ years of relevant industry experience. Key responsibilities include managing customer relationships, conducting cost analysis, and supporting product development.

Qualifications

• 10+ years of industry experience, specifically in semiconductor packaging.
• Expertise in Design of Experiments and Statistical Process Control.
• Strong knowledge of assembly processes and techniques.

Responsibilities

• Manage customer relationships to grow market share.
• Conduct detailed cost analysis on package types for quotes.
• Collaborate with engineering teams for product roadmap development.

Skills

Program management

Market share growth

Cost analysis

Communication skills

Education

Bachelor's degree in Engineering

Master's degree (preferred)

Tools

Microsoft Office

Job description

Position Summary

Amkor is recruiting for a Business Unit (BU) Product Management position for Advanced Chiplets/FCBGA Packaging in Tempe, AZ, where the primary function of this position is program management and to manage key customer accounts. Additionally, the position will drive internal process development and co-development programs in support of customers, off-shore factories and supplier development teams while supporting the qualification and mass production of Chiplets/FCBGA products. This individual will manage multiple day-to-day activities through internal management systems, as well as support existing customers.

Essential Duties And Responsibilities

• Partner with BU members to achieve annual goals, while managing customer relationships to grow market share.
• Promote Amkor package technologies directly to new and existing customers to find potential applications, deploying the flip chip package portfolio with key customers to gain business.
• Work closely with customer teams to understand the assembly, reliability and scheduling requirements for various new package configurations and product introductions. To include: substrate design, silicon to package interconnects, product assembly material selections, and manufacturing process requirements.
• Create detailed package/process risk assessments for the manufacturability and reliability of NPIs, including highlighting areas of customer requirements that drive cost and implementing mitigation plans to control them.
• Work closely with customer package engineering and Amkor factory engineering to understand/characterize prototype build plans; enabling successful qualifications and robust, on-time manufacturing production ramps. This will include assisting the team in designing experiments, analyzing factory build data, supporting root cause failure analysis investigation, and managing corrective action pathways to resolution.
• Create and maintain detailed cost analysis on package types, process flows, and customer product RFQs as well as provide detailed pricing inputs to Management and Sales on customer package engineering programs.
• Work with Amkor advanced product development teams on the transfer of new packaging technologies to production. This will include supporting cost analysis, CapEx requirements, manufacturability assessments, and program management through final qualification and initial production ramp.
• Work within the team to foster the development of product roadmaps, marketing strategies and business plans for continued growth in both existing and emerging markets.

Required Qualifications

• This position requires a Bachelor's degree in Engineering (Mechanical, Chemical, Electrical, Industrial, Materials Science or other relevant disciplines). Master's degree is a plus.
• 10+ years of demonstrated industry experience required, with semiconductor packaging experience required.
• Experience with Design of Experiments and Statistical Process Control is needed.
• Previous project management experience is a required.
• Knowledge of material and package characterization data analysis, test methods and qualification procedures are required.
• Strong understanding of wafer bump, fanout, assembly processes and techniques is necessary.
• Experience with cost modeling, pricing, quoting activities and products is needed.
• Proven ability to multiplex across numerous programs and teams is essential. Experience working with offshore factories is a plus.
• Demonstrated self-drive and motivation to adapt and overcome obstacles across a multi-faceted, dynamic, and fast-paced environment.
• Ability to work independently in a heavily matrixed organization.
• Requires excellent, demonstrated written and verbal communication skills.
• Ability to work independently, solve problems, resolve barriers to success is a must.
• Proficiency with Microsoft Office (Excel, PowerPoint, Outlook) is required.
• This position can require up to 10% travel.

Preferred Qualifications

• Flip Chip package design and OSAT experience will be a plus.
• Experience working with external customers is highly preferred.

Location

Tempe, AZ. This position has a hybrid schedule. Candidates must reside near the local Amkor office or be willing to relocate to be considered.

Amkor is proud to be an Equal Opportunity Employer. We do not discriminate on the basis of race, color, ancestry, national origin, religion or religious creed, mental or physical disability, medical condition, genetic information, sex (including pregnancy, childbirth, and related medical conditions), sexual orientation, gender identity, gender expression, age, marital status, military or veteran status, citizenship, or other characteristics protected by state or federal law or local ordinance.