Director, Chiplets & FCBGA Packaging PM

Amkor Technology, Inc.; Phoenix (AZ); Hybrid; USD 120,000 - 150,000; Full time

Job summary

Amkor Technology, Inc. is seeking a Business Unit Product Manager for Advanced Chiplets/FCBGA Packaging in Tempe, AZ. The role will focus on program management, key customer accounts, and driving internal process development. Candidates should have extensive experience in semiconductor packaging and excellent communication skills.

This position offers a hybrid work schedule and requires a Bachelor's degree in Engineering, with 10+ years of relevant industry experience. Key responsibilities include managing customer relationships, conducting cost analysis, and supporting product development.

Qualifications

• 10+ years of industry experience, specifically in semiconductor packaging.
• Expertise in Design of Experiments and Statistical Process Control.
• Strong knowledge of assembly processes and techniques.

Responsibilities

• Manage customer relationships to grow market share.
• Conduct detailed cost analysis on package types for quotes.
• Collaborate with engineering teams for product roadmap development.

Skills

Program management

Market share growth

Cost analysis

Communication skills

Education

Bachelor's degree in Engineering

Master's degree (preferred)

Tools

Microsoft Office

Job description

Amkor Technology, Inc. is seeking a Business Unit Product Manager for Advanced Chiplets/FCBGA Packaging in Tempe, AZ. The role will focus on program management, key customer accounts, and driving internal process development. Candidates should have extensive experience in semiconductor packaging and excellent communication skills.

This position offers a hybrid work schedule and requires a Bachelor's degree in Engineering, with 10+ years of relevant industry experience. Key responsibilities include managing customer relationships, conducting cost analysis, and supporting product development.