Senior Director, Advanced Packaging & Wafer Services

Amkor Technology, Inc.; Phoenix (AZ); Hybrid; USD 180,000 - 240,000; Full time

Job summary

Amkor Technology, Inc. in Tempe, AZ is seeking a senior Director of Advanced Packaging and Wafer Services to lead strategic programs and accelerate the commercialization of cutting-edge wafer-based package platforms for computing, networking, AI, and mobile segments.

The role drives technology roadmaps, manages Tier 1 customer engagements, and coordinates global R&D teams to ensure development success through qualification and ramp to production.

Qualifications

• Bachelor's degree in Engineering; Master's or Ph.D. preferred.
• 10+ years in semiconductor package development or wafer process.
• Proven leadership in advanced packaging programs with major customers.
• Strong understanding of IC package architecture and wafer integration.
• Ability to travel 10–20% domestically and internationally.

Responsibilities

• Lead strategic engagements with Tier 1 customers and align requirements with roadmaps.
• Coordinate development activities with global R&D teams for timely programs.
• Interface for customer meetings, executive reviews, and issue resolution during development and ramp.
• Guide cross-functional teams across R&D, design, characterization, process engineering, product management, operations, suppliers, and business development.
• Own customer product management from concept through production ramp.
• Guide design rules, materials, reliability, manufacturability, cost, schedule, and yield tradeoffs.
• Engage with ecosystem partners and wafer processing suppliers to influence roadmap direction.

Skills

Leadership

Customer engagement

Cross-functional teamwork

Communication skills

Travel willingness

Education

Bachelor's in Engineering

Master's/PhD preferred

Job description

Amkor Technology, Inc. in Tempe, AZ is seeking a senior Director of Advanced Packaging and Wafer Services to lead strategic programs and accelerate the commercialization of cutting-edge wafer-based package platforms for computing, networking, AI, and mobile segments.

The role drives technology roadmaps, manages Tier 1 customer engagements, and coordinates global R&D teams to ensure development success through qualification and ramp to production.