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SkyWater Technology, Inc. in Florida is seeking a Metrology Process Engineer to lead, develop, and improve metrology for advanced packaging flows and HI platform technologies such as Hybrid Bonding, Direct Bond Interconnect, 2.5D/3D interposer, and Fan‑Out Wafer Level Packaging.
You will implement metrology support systems, monitor defect and thickness measurements, review SPC data for excursions, and collaborate with process and tool engineers to drive yield improvements across fab areas.
We are looking for a Metrology Process Engineer for our Florida Advanced Packaging site. In this role, you will lead, develop, and improve Metrology processes for integrated Advanced Packaging process flows and Heterogenous Integration (HI) platform technologies such as Hybrid Bonding and Direct Bond Interconnect (DBI), 2.5D and 3D Interposer, and Fan-Out Wafer Level Packaging (FOWLP). Excellent oral and written communication skills are required to communicate ideas with foundry customers, colleagues, and management.
The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position.
BS with 0-2 years experience in Electrical Engineering, Electronics Engineering, or a related BS Engineering; MS or PhD would be a plus.