Metrology Process Engineer for Advanced Packaging & HI

SkyWater Technology

Kissimmee (FL)

On-site

USD 69,000 - 104,000

Full time

6 hours ago
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Benefits offered by this job

401(k) match
Life insurance
On-site fitness facility
On-site self-serve market

Job summary

SkyWater Technology is seeking a Metrology Process Engineer for its Florida Advanced Packaging site. You will lead, develop, and improve metrology processes across HI platform technologies including Hybrid Bonding, DBI, 2.5D/3D interposers and FOWLP.

Strong communication with customers, colleagues, and management is required. Qualifications include a BS in Electrical Engineering with 0-2 years experience, MEMS/CMOS/metrology knowledge, and DOE/SPC/Six Sigma familiarity.

Qualifications

  • BS with 0-2 years experience in Electrical/ Electronics Engineering or related BS Engineering
  • MS or PhD would be a plus
  • Experience with metrology, defect inspection, and packaging

Responsibilities

  • Implement and maintain metrology support systems and data collection
  • Ensure metrology supports multiple fab areas with thickness and defect measurements
  • Review defects and SPC data for excursions and drive yield improvements
  • Coordinate reporting die pad locations through automation in FOWLP
  • Investigate and drive integration changes for improved device performance
  • Collaborate with process and tool engineers to identify marginalities and improvements

Skills

Metrology
Defect inspection
MEMS/CMOS/Packaging
DOE, SPC, Six Sigma
Problem solving
Data-driven

Education

BS in Electrical/Electrical Engineering
MS or PhD a plus

Job description

SkyWater Technology is seeking a Metrology Process Engineer for its Florida Advanced Packaging site. You will lead, develop, and improve metrology processes across HI platform technologies including Hybrid Bonding, DBI, 2.5D/3D interposers and FOWLP.

Strong communication with customers, colleagues, and management is required. Qualifications include a BS in Electrical Engineering with 0-2 years experience, MEMS/CMOS/metrology knowledge, and DOE/SPC/Six Sigma familiarity.

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