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Ingersoll Rand is seeking a Data Center Thermal Application Engineer to design and deploy advanced cooling solutions for high-density workloads (AI/ML, HPC). This role covers liquid cooling with CDUs and direct-to-chip cooling, as well as high-performance air cooling with dry coolers and fan arrays.
You will collaborate with CDU suppliers, perform thermal calculations, validate designs with CFD tools, and support installation, commissioning, and optimization across sites in OR/PA.
Ingersoll Rand is seeking a Data Center Thermal Application Engineer to design and deploy advanced cooling solutions for high-density workloads (AI/ML, HPC). This role covers liquid cooling with CDUs and direct-to-chip cooling, as well as high-performance air cooling with dry coolers and fan arrays.
You will collaborate with CDU suppliers, perform thermal calculations, validate designs with CFD tools, and support installation, commissioning, and optimization across sites in OR/PA.