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Ingersoll Rand is seeking a Thermal Application Engineer- Data Center to design and deploy advanced cooling solutions for high-density workloads. You will work on liquid cooling with CDUs, direct-to-chip cooling, and high-performance air systems, interfacing with CDU suppliers and field teams.
Responsibilities include system-level architecture, airflow optimization, and support through FAT/SAT testing, with 25–40% travel.
Ingersoll Rand is seeking a Thermal Application Engineer- Data Center to design and deploy advanced cooling solutions for high-density workloads. You will work on liquid cooling with CDUs, direct-to-chip cooling, and high-performance air systems, interfacing with CDU suppliers and field teams.
Responsibilities include system-level architecture, airflow optimization, and support through FAT/SAT testing, with 25–40% travel.