Data Center ICT Technical Lead – Hyperscale Campus Design

Cerami & Associates Inc; New York (NY); On-site; USD 140,000 - 190,000; Full time

Job summary

Cerami & Associates Inc. is seeking an experienced ICT Technical Lead to provide management and design oversight for outside plant and inside plant cabling on large-scale data center campuses.

This role ensures design quality, on-time delivery, and effective coordination with civil, electrical, BIM, and client teams across multiple projects. The successful candidate will lead engineering teams, translate client requirements into buildable designs, and drive scalable standards for duct banks,

Qualifications

• Experience leading large ICT infrastructure design projects in data centers.
• Deep expertise in OSP pathways and cabling (duct banks, manholes, campus fiber).
• Strong BIM design workflows, model coordination, clash detection.

Responsibilities

• Serve as technical authority for OSP/ISP design across data center campuses.
• Lead development of scalable standards for underground duct banks and campus distribution.
• Coordinate with civil, structural, electrical, mechanical, and BIM teams to resolve cross-discipline issues.
• Guide teams through design challenges for hyperscale capacity, redundancy, and expansion.
• Support client engagements, workshops, and design reviews.

Skills

OSP cabling

ISP cabling

BIM workflows

Data center infrastructure

Team leadership

Client engagement

Standards compliance

Cross-discipline coordination

Education

BS in Engineering or related

Tools

Revit

BIM coordination

Job description

Cerami & Associates Inc. is seeking an experienced ICT Technical Lead to provide management and design oversight for outside plant and inside plant cabling on large-scale data center campuses.

This role ensures design quality, on-time delivery, and effective coordination with civil, electrical, BIM, and client teams across multiple projects. The successful candidate will lead engineering teams, translate client requirements into buildable designs, and drive scalable standards for duct banks,