Copper Plating Engineer

3D Glass Solutions, Inc-; Albuquerque (NM); On-site; USD 70,000 - 90,000; Full time

Job summary

3D Glass Solutions, Inc- is hiring a Copper Plating Engineer in Albuquerque, NM. This role involves developing and optimizing plating processes and troubleshooting manufacturing defects. Ideal candidates hold a bachelor’s degree in engineering and have 2-5 years of plating experience. Strong communication and experimental skills are essential. The position may require relocation to India. Benefits include a dynamic work environment and the opportunity for hands-on engineering challenges.

Qualifications

• 2-5 years of experience in copper plating or advanced packaging process engineering.
• Experience using electroplating waveforms (DC, pulse, pulse-reverse).
• Strong record of solving plating and integration challenges.

Responsibilities

• Develop and optimize ABF and DFR lamination processes.
• Run experiments to improve lamination quality.
• Troubleshoot adhesion loss and defects.

Skills

Experimental skills

Data analysis

Problem-solving

Communication

Copper electroplating experience

Education

Bachelor’s degree in Chemical Engineering, Materials Science, or Mechanical Engineering

Tools

Electroplating waveforms usage

Plating tools and wet benches

Job description

Job/Position Summary

The Copper Plating Engineer will develop, optimize, and support copper electroplating and electroless plating processes. This role is ideal for an engineer who enjoys working directly with tools and chemistries, running experiments, solving problems quickly, and contributing across R&D and early manufacturing environments.

Primary Responsibilities

• Develop and optimize ABF and DFR lamination processes for advanced packaging applications.
• Run experiments to improve lamination quality, adhesion, and yield.
• Support DFR exposure and development processes and chemistry control.
• Troubleshoot adhesion loss, voiding, wrinkling, delamination, warpage, and defectivity.
• Develop and maintain ABF/DFR adhesion to glass and copper surfaces.
• Support ABF laser structuring and via formation processes.
• Set up, qualify, and maintain ABF/DFR lamination and exposure equipment.
• Work closely with integration, laser, plating, and reliability teams.
• Collect and analyze process data; apply DOE and root cause analysis to drive improvements.
• Support scale‑up from R&D to pilot and early manufacturing environments.
• Perform additional functions and other duties as assigned or required.

Requirements

• Bachelor’s degree in Chemical Engineering, Materials Science, Mechanical Engineering, or related field required.
• 2-5 years of experience in copper plating or advanced packaging process engineering.
• Panel‑level plating experience is desired.
• An advanced packaging or heterogeneous integration background is desired.
• Willing to relocate to Albuquerque, New Mexico, for 1-2 years and willing to relocate to India for 2 years or permanently.
• This position will require lawful access to ITAR/EAR controlled information, and employees in these roles will need to meet those requirements. Requirements include US Citizenship, US Permanent Resident, or the ability to meet contract‑specific licensure requirements.

Knowledge, Skills, and Abilities

• Strong experimental skills and data‑driven problem‑solving approach.
• Comfortable working in a startup environment with evolving requirements.
• Ability to work independently and across disciplines.
• Strong experimental design and data analysis skills.
• Proven track record of solving complex plating and integration challenges.
• Hands‑on experience with copper electroplating chemistries.
• Familiarity with plating chemistry additives (suppressors, accelerators, levelers).
• Experience using electroplating waveforms (DC, pulse, pulse‑reverse).
• Understanding of electroless copper plating and copper seed layer formation.
• Experience with plating tools and wet benches.
• Knowledge of defect mechanisms and process control in copper plating.
• Excellent communication and mentoring skills.
• Experience scaling processes from R&D to pilot or production is desired.
• Familiarity with SPC, FMEA, and yield analysis and methodologies is desired.

Physical/Working Requirements

• Must be able to wear personal protective gear most of the day (where applicable).
• Prolonged periods of sitting or standing.

Behavioral Traits

• Strong verbal and written communication skills to convey quality standards, expectations, and feedback clearly to team members and stakeholders.
• A willingness to adjust to changing circumstances, processes, or technologies for continuous improvement in dynamic environments.
• The ability to work well with others, fostering a cooperative atmosphere, driving data management initiatives, and engaging all levels of the organization.