Electroplate Engineering Manager

3D Glass Solutions, Inc-; Albuquerque (NM); On-site; USD 110,000 - 160,000; Full time

Job summary

3D Glass Solutions, Inc- is seeking an Electroplate Team Leader to provide technical leadership for back-end thick Cu (bump) integration. Expertise in photolithography, electroplating, spin-on dielectrics, and laminate films is essential.

You will lead R&D toward new capabilities and manage transitions to high-volume manufacturing while reporting to executive management. Strong project management and executive presentation skills are required.

Qualifications

• Bachelor of Science in Engineering is required.
• 10+ years in semiconductor manufacturing with thick Cu bump experience.
• People management or program leadership experience.
• Ability to present to company executives.
• ITAR/EAR requirements may apply (US citizenship or residency).

Responsibilities

• Provide technical expertise in electroplating and lead R&D to expand capabilities.
• Lead dicing, etch, and solder ball attach efforts.
• Support manufacturing continuous improvement initiatives.
• Evaluate and improve processes using DOE and disciplined problem solving.
• Maintain safe, reliable manufacturing systems while improving quality and yields.
• Develop innovative solutions and incorporate new methods.
• Collaborate with external partners and universities on R&D.
• Inspect materials and equipment to detect defects and drive improvements.
• Determine root causes of failures and propose design or process changes.

Skills

Team leadership

Project management

Electroplating

Semiconductor manufacturing

Root cause analysis

Education

Bachelor of Science in Engineering

Job description

Job/Position Summary

The Electroplate Team Leader must provide technical expertise around back-end thick Cu (Bump) integration. Knowledge of photolithography, electroplating, spin-on dielectrics, as well as laminate films is a must. This individual must be able to lead teams and have excellent project management skills. Knowledge and experience of moving from R&D to high volume manufacturing in semiconductor manufacturing would put this individual above other candidates.

This individual will have full visibility to the entire executive management team, with the ability to advance as the company expands and grows.

Primary Responsibilities

• Provide technical expertise in electroplating. Lead R&D efforts to further expand current capability.
• Provide and lead efforts for dicing, etch, and solder ball attach.
• Provide support related to manufacturing continuous improvement efforts.
• Evaluate and improve manufacturing processes and manufacturing systems through disciplined problem-solving methodology and design of experiments.
• Maintain reliable and safe manufacturing systems while improving quality, yields, production rates, efficiencies, and reducing costs.
• Develop innovative solutions and incorporate new methods and processes to improve existing operations.
• Work with external companies and universities to continue R&D efforts on the latest integration improvements.
• Inspect materials, products, or equipment to detect defects or malfunctions in an effort to drive improvements.
• Determine root causes of failures using statistical methods and recommend changes in designs, tolerances, or processing methods.

Requirements

• Bachelor of Science in Engineering.
• 10+ years of experience in a semiconductor manufacturing environment. Must have knowledge of thick Cu (bump) manufacturing integration.
• People management or program leadership experience.
• Ability to effectively present to company executives.
• This position will require lawful access to ITAR/EAR controlled information, and employees in these roles will need to meet those requirements. Requirements include US Citizenship, US Permanent Resident, or ability to meet contract-specific licensure requirements.

Knowledge, Skills, and Abilities

• Experience withproviding technical expertise and sustaining support related to manufacturing and R&D.
• Must be able to lead teams and projects effectively.
• Knowledge of manufacturing methods and procedures.
• Ability to solve technical problems both independently and within a team.
• Knowledge of process improvement strategies around backend thick Cu processing.

Physical/Working Requirements

• Must be able to wear personal protective gear most of the day (where applicable)
• Prolonged periods of sitting or standing

Behavioral Traits

• Strong verbal and written communication skills to convey quality standards, expectations, and feedback clearly to team members and stakeholders.
• A willingness to adjust to changing circumstances, processes, or technologies for continuous improvement in dynamic environments.
• The ability to work well with others, fostering a cooperative atmosphere, driving data management initiatives and engaging all levels of the organization.