LFAB Cu Plating Process Engineer

118-WW TMG MFG OPS; Lehi (UT); On-site; USD 90,000 - 120,000; Full time

Job summary

LFAB (Lehi Fab) in Utah is seeking an experienced Manufacturing Process Engineer focused on Cu plating. You will join a team driving sustainment, development and transfer of plating processes for high-volume 300mm wafer production.

The role emphasizes supporting operations, startup executions, SWRs, data-driven process improvements, and cross-functional collaboration to boost yields and efficiency across Analog Technologies and 28nm CMOS planar tech.

Qualifications

• 3 years of experience in Electroplating/Plating within the semiconductor industry.
• Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science, Mechanical Engineering, Physics, or a related field.
• Strong foundation in statistical process control, engineering change control and process release strategies.

Responsibilities

• Join the team of dynamic engineers that work on process sustenance, development and transfer
• Support manufacturing operations
• Perform lot and equipment dispositions to support the continuous flow of production and to minimize cycle time in a high volume manufacturing 300mm wafer Fab running Analog Technologies
• Support the manufacturing ramp with execution of equipment/process startup, process experiments (SWRs)
• Develop and implement improved methods of manufacturing, procedures, and processes that result in improved efficiencies, yields, machine operations, and quality
• Implement project or improvement plans for areas of responsibility including but not limited to: efficiency improvements, cost reduction or quality improvement programs, new product support and other process improvements
• Identify systematic problems in either process or equipment related sources and communicating findings to the engineering staff in a continuous manner
• Participate in data analysis and problem resolution
• Support 28nm CMOS Planar technology

Skills

Cu Plating

Process Engineering

Statistical Process Control

Problem Solving

Data Analysis

Education

Bachelor's degree in Chemical Engineering or related field

Job description

Change the world. Love your job. We’re at the forefront of an exciting era of growth and innovation at LFAB (Lehi Fab), where our state‑of‑the‑art 300mm, 65nm, 45nm and 28nm analog and embedded wafer manufacturing facilities are driving production of a diverse semiconductor portfolio in the heart of the Silicon Slopes. As we continue to expand we’re seeking an experienced Cu Plating Process Engineer. At full production, our wafer fabs will manufacture tens of millions of analog and embedded processing chips every day and power electronics everywhere, supporting customer demand for decades to come. We’re committed to responsible, sustainable manufacturing and making a meaningful impact on the local community through job creation and substantial investments in K‑12 STEM education. In this role, you will be part of the factory team that will lead the activities ramp of our latest 28nm technology to yield entitlement, helping shape the future of the semiconductor industry.

The responsibilities of a Manufacturing Process Engineer in this role include:

• Join the team of dynamic engineers that work on process sustenance, development and transfer
• Support manufacturing operations
• Perform lot and equipment dispositions to support the continuous flow of production and to minimize cycle time in a high volume manufacturing 300mm wafer Fab running Analog Technologies
• Support the manufacturing ramp with execution of equipment/process startup, process experiments (SWRs)
• Develop and implement improved methods of manufacturing, procedures, and processes that result in improved efficiencies, yields, machine operations, and quality
• Implement project or improvement plans for areas of responsibility including but not limited to: efficiency improvements, cost reduction or quality improvement programs, new product support and other process improvements
• Perform lot and equipment dispositions to support the continuous flow of production and to minimize cycle time in a high volume manufacturing 300mm wafer Fab running Analog Technologies
• Identify systematic problems in either process or equipment related sources and communicating findings to the engineering staff in a continuous manner
• Support the manufacturing ramp with execution of equipment/process startup, process experiments (SWRs)
• Participate in data analysis and problem resolution
• Support 28nm CMOS Planar technology

Minimum requirements:

• 3 years of experience within the Semiconductor industry within Electroplating/Plating.
• Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related engineering field
• Strong foundation in statistical process control, engineering change control and process release strategies

Preferred qualifications:

• Experience with Cu Plating and Cu Barrier Seed.
• BEOL process integration experience
• Demonstrated strong analytical and problem solving skills
• Ability to adapt and be dynamic
• Ability to work effectively in a fast‑paced and rapidly changing environment
• Ability to take the initiative and drive for result
• Demonstrated ability to build strong, influential relationships
• Strong verbal and written communication skills
• Ability to work in teams and collaborate effectively with people in different functions
• Strong time management skills that enable on‑time project delivery