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3D Glass Solutions, Inc- is seeking an Electroplate Team Leader to provide technical leadership for back-end thick Cu (bump) integration. Expertise in photolithography, electroplating, spin-on dielectrics, and laminate films is essential.
You will lead R&D toward new capabilities and manage transitions to high-volume manufacturing while reporting to executive management. Strong project management and executive presentation skills are required.
3D Glass Solutions, Inc- is seeking an Electroplate Team Leader to provide technical leadership for back-end thick Cu (bump) integration. Expertise in photolithography, electroplating, spin-on dielectrics, and laminate films is essential.
You will lead R&D toward new capabilities and manage transitions to high-volume manufacturing while reporting to executive management. Strong project management and executive presentation skills are required.