Cryogenic RF Packaging & Substrate Engineer

Translarity, Inc.; Fremont (CA); On-site; USD 120,000 - 180,000; Full time

Benefits offered by this job

401(k)

Health insurance

Paid time off

Vision insurance

Job summary

Translarity, Inc. is expanding its wafer test and packaging capabilities and seeking an engineer to design package and substrate hardware for quantum computing applications.

This role involves working at cryogenic temperatures, handling microwave signals, and pushing conventional packaging concepts beyond the standard rules. You will start from strong fundamentals and drive designs from concept to production.

Qualifications

• 5+ years hands-on in advanced or heterogeneous IC packaging, or substrate design.
• BS in Electrical/Mechanical/Materials Science, Physics or related field; MS or PhD a plus.

Responsibilities

• Own package and substrate design for quantum hardware, from concept through production
• Design for RF/microwave signal integrity, power delivery, and thermal performance at cryogenic temperatures
• Work directly with manufacturing, test, and customer engineering
• Take designs into the lab and prove them out

Skills

Direct SoC experience

End-to-end design ownership

Education

BS in Electrical/Mechanical/Materials Science/Physics (or related)

MS or PhD preferred

Job description

Translarity, Inc. is expanding its wafer test and packaging capabilities and seeking an engineer to design package and substrate hardware for quantum computing applications.

This role involves working at cryogenic temperatures, handling microwave signals, and pushing conventional packaging concepts beyond the standard rules. You will start from strong fundamentals and drive designs from concept to production.