Quantum Cryogenic Hardware Engineer

Amazon Inc.

Pasadena (CA)

Hybride

USD 143 000 - 193 000

Plein temps

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Résumé du poste

Amazon's Center for Quantum Computing in Pasadena is seeking a Quantum Research Engineer focused on hardware design for cryogenic environments. You will own high-density packaging for quantum processor units and cryogenic signal conditioning sub-assemblies, working with cross-functional teams through the full product development cycle.

The role requires strong 3D CAD (SolidWorks), thermal and structural FEA (Ansys/COMSOL), and a deep grounding in cryogenic engineering.

Qualifications

  • Bachelor's degree or higher in mechanical or electrical engineering, physics, or materials science.
  • 6+ years with cryogenic mechanical design and product development lifecycle.
  • Experience with cryogenic design and FEA tools (Thermal, Mechanical, EM) and SolidWorks.
  • Design for manufacturing knowledge.

Responsabilités

  • High density novel packaging solutions for quantum processor units.
  • Cryogenic mechanical design for novel cryogenic signal conditioning sub-assemblies.
  • Cryogenic mechanical design for signal delivery systems.
  • Simulation-driven designs to reduce EMI within the qubit environment.
  • Own end-to-end product development through requirements, design reports, design reviews, assembly/testing documentation, and final delivery.

Connaissances

Cryogenic mechanical design
Cross-functional collaboration
Product development lifecycle
Mechanical engineering principles

Formation

Bachelor's degree in mechanical engineering
Master's or PhD in related field

Outils

SolidWorks
Ansys
COMSOL
3D CAD

Description du poste

Amazon's Center for Quantum Computing in Pasadena is seeking a Quantum Research Engineer focused on hardware design for cryogenic environments. You will own high-density packaging for quantum processor units and cryogenic signal conditioning sub-assemblies, working with cross-functional teams through the full product development cycle.

The role requires strong 3D CAD (SolidWorks), thermal and structural FEA (Ansys/COMSOL), and a deep grounding in cryogenic engineering.

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