Cryogenic Photonics Packaging & Integration Engineer

Quandela; United States; Remote; USD 73,000 - 101,000; Full time

Benefits offered by this job

Competitive salary

Company savings plan

100% health coverage (Alan)

50% transport reimbursement or bonus

Meal vouchers, Gymlib fitness support

Childcare assistance & referral Bonu…€

Meaningful role with real ownership

Hybrid work model (3-4 days onsite, 1-

Exposure to quantum stack

Job summary

Quandela in Massy, France, is seeking a mid-level Photonics Packaging & Cryogenic Integration Engineer to contribute to the development and industrialization of photonic quantum systems.

You will focus on packaging single-photon sources, photonic ICs and optical components into complete systems, and you will design, prototype and test these under cryogenic conditions to enable scalable production.

Qualifications

• Cryogenic systems experience in very low temperatures.
• Photonic or optoelectronic packaging expertise.
• Chip bonding or micro-assembly techniques.
• Pick-and-place or precision assembly.
• Nano-positioning and multi-axis motion control.
• Robotics or computer vision experience.
• FPGA or microcontroller development.
• PCB design with KiCad or similar.
• Finite-element simulation (ANSYS/COMSOL) experience.
• Experience in semiconductor or quantum photonics environments.

Responsibilities

• Design and develop packaging and integration solutions for photonic and quantum devices.
• Integrate single-photon sources, photonic integrated circuits and optical components into complete systems.
• Develop and optimize optical coupling strategies, including fiber coupling and direct chip-to-chip integration.
• Design, build and assemble precision positioning and alignment systems, including nano-positioning stages and multi-axis platforms.
• Develop experimental setups operating under cryogenic conditions, typically in the 2-4 K range.
• Design mechanical parts and assemblies using CAD tools.
• Contribute to electronics development, including PCB design, instrumentation and control systems.
• Automate alignment, test and characterization processes using Python, C++, Rust or similar programming languages.
• Work with microcontrollers, FPGA-based systems or other hardware‑control architectures when relevant.
• Build, test and iterate rapidly on prototypes, including using 3D printing and other rapid prototyping techniques.

Skills

Cryogenic systems

Photonic packaging

Optoelectronic packaging

Nano-positioning

FPGA development

Python

C++

Robotics

CAD tools

3D printing

Tools

KiCad

ANSYS

COMSOL

Job description

Quandela in Massy, France, is seeking a mid-level Photonics Packaging & Cryogenic Integration Engineer to contribute to the development and industrialization of photonic quantum systems.

You will focus on packaging single-photon sources, photonic ICs and optical components into complete systems, and you will design, prototype and test these under cryogenic conditions to enable scalable production.