Photonics Packaging & Cryogenic Integration R&D Engineer

Quandela; United States; Remote; USD 73,000 - 101,000; Full time

Benefits offered by this job

Competitive salary

Company savings plan

100% health coverage (Alan)

50% transport reimbursement or bonus

Meal vouchers, Gymlib fitness support

Childcare assistance & referral Bonu…€

Meaningful role with real ownership

Hybrid work model (3-4 days onsite, 1-

Exposure to quantum stack

Job summary

Quandela in Massy, France, is seeking a mid-level Photonics Packaging & Cryogenic Integration Engineer to contribute to the development and industrialization of photonic quantum systems.

You will focus on packaging single-photon sources, photonic ICs and optical components into complete systems, and you will design, prototype and test these under cryogenic conditions to enable scalable production.

Qualifications

• Cryogenic systems experience in very low temperatures.
• Photonic or optoelectronic packaging expertise.
• Chip bonding or micro-assembly techniques.
• Pick-and-place or precision assembly.
• Nano-positioning and multi-axis motion control.
• Robotics or computer vision experience.
• FPGA or microcontroller development.
• PCB design with KiCad or similar.
• Finite-element simulation (ANSYS/COMSOL) experience.
• Experience in semiconductor or quantum photonics environments.

Responsibilities

• Design and develop packaging and integration solutions for photonic and quantum devices.
• Integrate single-photon sources, photonic integrated circuits and optical components into complete systems.
• Develop and optimize optical coupling strategies, including fiber coupling and direct chip-to-chip integration.
• Design, build and assemble precision positioning and alignment systems, including nano-positioning stages and multi-axis platforms.
• Develop experimental setups operating under cryogenic conditions, typically in the 2-4 K range.
• Design mechanical parts and assemblies using CAD tools.
• Contribute to electronics development, including PCB design, instrumentation and control systems.
• Automate alignment, test and characterization processes using Python, C++, Rust or similar programming languages.
• Work with microcontrollers, FPGA-based systems or other hardware‑control architectures when relevant.
• Build, test and iterate rapidly on prototypes, including using 3D printing and other rapid prototyping techniques.

Skills

Cryogenic systems

Photonic packaging

Optoelectronic packaging

Nano-positioning

FPGA development

Python

C++

Robotics

CAD tools

3D printing

Tools

KiCad

ANSYS

COMSOL

Job description

Photonics Packaging & Cryogenic Integration R&D Engineer at Quandela, Massy, Île-de-France, France (remote). A mid-level full time position in the Research team, listed under hardware engineering.

Description of the Team/Project

We are looking for a Photonics Packaging & Cryogenic Integration Engineer to contribute to the development and industrialization of our photonic quantum systems.

You will work on the integration of single-photon sources, photonic integrated circuits and optical/electromechanical assemblies , with a strong focus on miniaturization, automation and operation under cryogenic conditions.

This is a highly hands‑on role at the intersection of photonics, electronics, mechanics, automation and experimental physics.

You will contribute across the full development cycle: design, prototyping, assembly, testing, optimization and transfer toward industrial‑scale production.

Nice to Have

More than a specific academic background, we are looking for someone who enjoys building complex scientific systems and solving problems directly at the hardware level.

Process

• Talent Acquisition Interview (30' - 45')
• Hiring Managers Interview (45')
• Use Case (a live use case or one to be prepared at home and presented afterward)
• Meeting with the teams
• 2 to 3 reference check
• Offer

(This process is provided for guidance only and may evolve depending on the roles)

At Quandela, we believe that the strength of our team is the plurality of experiences, perspectives, and journeys. We are committed to building a respectful, inclusive, and welcoming work environment. All applications are welcome.

Responsibilities

• Design and develop packaging and integration solutions for photonic and quantum devices.
• Integrate single-photon sources, photonic integrated circuits and optical components into complete systems.
• Develop and optimize optical coupling strategies, including fiber coupling and direct chip-to-chip integration.
• Design, build and assemble precision positioning and alignment systems, including nano-positioning stages and multi-axis platforms.
• Develop experimental setups operating under cryogenic conditions, typically in the 2-4 K range.
• Design mechanical parts and assemblies using CAD tools.
• Contribute to electronics development, including PCB design, instrumentation and control systems.
• Automate alignment, test and characterization processes using Python, C++, Rust or similar programming languages.
• Work with microcontrollers, FPGA-based systems or other hardware‑control architectures when relevant.
• Build, test and iterate rapidly on prototypes, including using 3D printing and other rapid prototyping techniques.

Requirements

• Cryogenic systems and experiments at very low temperatures.
• Photonic or optoelectronic packaging.
• Chip bonding, indium bump bonding or related micro‑assembly techniques.
• Pick‑and‑place systems or automated precision assembly.
• Nano‑positioning and multi‑axis motion control systems.
• Robotics or computer vision.
• FPGA or microcontroller development.
• PCB design using KiCad or similar tools.
• Finite‑element simulation using tools such as ANSYS or COMSOL.
• Semiconductor or quantum photonics environments.

Nice to Have

• A PhD in electrical engineering, mechanical engineering, applied physics, condensed matter physics, solid‑state physics, optics, photonics or a related field.
• Strong hands‑on experience building and testing scientific or high‑precision equipment.
• Experience with photonics, optomechanics, semiconductor devices, cryogenics or precision engineering.
• Familiarity with optical alignment, fiber coupling and/or photonic packaging.
• Experience with mechanical design and CAD tools.
• Good understanding of electronics, instrumentation and test equipment.
• Programming skills in Python, C++, Rust or similar languages for automation and hardware control.
• Experience working with multidisciplinary systems combining optics, mechanics, electronics and software.

Benefits

• Competitive salary, flexible based on your experience
• Company savings plan
• 100% health coverage (Alan)
• 50% transport reimbursement or sustainable mobility bonus
• Meal vouchers (Swile), Gymlib fitness support
• Childcare assistance & referral bonuses (€1,000-€2,000)
• A meaningful role with real ownership, from day one
• A team eager to collaborate and grow with you
• A hybrid work model (3-4 days/week onsite in Massy, 1 day in Paris or 1 to 2 days remotely)
• Daily exposure to the entire quantum stack - from high-level APIs to low-level firmware, and everything in between.