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Micron Technology, Inc. is seeking a Staff Process Engineer in Advanced Packaging CMP to start up, develop, and optimize CMP processes.
The role focuses on improving product quality, yield, and reliability while reducing costs, with significant collaboration across regions and vendors. The candidate will diagnose and resolve assembly process issues using FMEA, 8D, and SPC/FDC methodologies, and contribute to strategic projects, technology advances, and IP generation.
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
As a Staff Process Engineer in Advanced Packaging CMP team, you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. This position requires communication and collaboration with associates both within the region and internationally. Strict adherence to Micron Intellectual Property Protection policy is vital. This role will also extensively collaborate with vendors to develop processes that meet integration requirements.
Semiconductor Process Engineer 4
Relocation Level: TBD
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.