CMP Process Development Engineer – Yield & Innovation

Skorpios Technologies, Inc.

Temecula (CA)

On-site

USD 100,000 - 140,000

Full time

14 days+
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Benefits offered by this job

Medical
Dental
Vision
401(k)
Life Insurance
Disability
Paid Holidays
Paid Vacation
Gym Membership Discounts

Job summary

Skorpios Technologies, Inc. in Temecula, CA is seeking a CMP Process Development Engineer to develop manufacturable, high‑yield CMP processes for state‑of‑the‑art devices in aerospace, defense, bioelectronics, and high‑speed communications.

The role requires an MS or PhD in Electrical Engineering, Materials Science, Physics or Chemistry and hands‑on experience in wafer polishing and post‑polish cleaning. You will work with multiple teams to implement improvements and ensure IP protection.

Qualifications

  • MS or PhD in Science with emphasis/majors in Electrical Engineering, Materials Science, Physics or Chemistry; equivalent industry experience acceptable.
  • Advanced degrees and development experience welcomed.
  • Experience in Chemical and Mechanical Polish and post-polish wafer cleaning; Cu plating experience a plus.

Responsibilities

  • Execute experiments and optimize processes during 24x7 fab operation; assist technicians and analyze metrology results to drive yields.
  • Sustain and improve wafer fabrication processes; ensure product conformance to specs and quality requirements.
  • Create and maintain operating specifications; drive innovation and continuous improvement; monitor SPC health.

Skills

Data analysis
DOE
SPC
Communication
Team collaboration

Education

MS/PhD in Electrical Engineering, Materials Science, Physics or Chemistry

Tools

MS Office Word
MS Office Excel
PowerPoint

Job description

Skorpios Technologies, Inc. in Temecula, CA is seeking a CMP Process Development Engineer to develop manufacturable, high‑yield CMP processes for state‑of‑the‑art devices in aerospace, defense, bioelectronics, and high‑speed communications.

The role requires an MS or PhD in Electrical Engineering, Materials Science, Physics or Chemistry and hands‑on experience in wafer polishing and post‑polish cleaning. You will work with multiple teams to implement improvements and ensure IP protection.

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