Business Market Development Manager – AI Data Center Solutions

Rohde & Schwarz GmbH & Co.; Austin, Boston, San Francisco (TX, MA, CA); On-site; USD 120,000 - 160,000; Full time

Job summary

Rohde & Schwarz GmbH & Co. in Austin is seeking a technically oriented field professional to drive engagement with interconnect stakeholders and promote advanced measurement solutions for AI workloads.

You will collaborate with customers on VNA adoption, interface validation, and signal integrity, while representing the company at industry events and technical seminars.

Responsibilities

• Engage interconnect customers: build relationships with key stakeholders in high-speed interconnects (twinax, backplanes, AECs, optical connectors for AI scaling).
• Promote VNA adoption: position R&S ZNA/ZNB as premier multi-port S-parameter solution with fixture de-embedding and time-domain analysis.
• Position AI-focused solutions: showcase oscilloscopes RTP/RTO with VNAs for AI workloads.
• Validate high-speed interfaces: cover PCIe Gen6/7, DDR5/6, CXL, 400G/800G/1.6T Ethernet.
• Advise on SI/PI methods using R&S gear to tackle physical layer limits, loss, multi-phase power, and crosstalk.
• Collaborate: host seminars and represent at events like HS Digital Test Forum to discuss interconnect verification.

Job description

• Interconnect Customer Engagement: Build strong relationships with key stakeholders in the interconnect market—including manufacturers of high-speed twinax cables, PCB backplanes, active electrical cables (AECs), and advanced optical connectors critical to scaling AI clusters.
• Drive VNA Adoption: Position the Rohde & Schwarz Vector Network Analyzer Portfolio (such as the R&S®ZNA and R&S®ZNB series) as the premier solution for multi-port S-parameter extraction, fixture de-embedding, and time-domain analysis.
• Portfolio Positioning: Drive the commercial adoption of specialized R&S solutions tailored for AI workloads, showcasing our flagship Rohde & Schwarz Oscilloscopes (R&S®RTP/R&S®RTO series) alongside our VNA offerings.
• Technical Interface Validation: Position R&S testing solutions across high-speed digital interfaces critical to AI performance, including PCIe Gen 6/7, DDR5/6, CXL, and high-speed Ethernet (400G/800G/1.6T protocols).
• Signal & Power Integrity Applications: Consult customers on advanced test methodologies using R&S equipment to solve physical layer limitations, high-frequency channel losses, multi-phase power rail disturbance, and complex crosstalk issues.
• Strategic Collaboration: Host technical seminars and represent the company at key industry events like the Rohde & Schwarz High-Speed Digital Test Forum to promote innovative verification frameworks for interconnect compliance.