Avionics Network Hardware Engineer - High-Speed PCB Design

Socket.dev; Cedar Rapids (IA); On-site; USD 69,000 - 131,000; Full time

Benefits offered by this job

Medical, dental, and vision insurance

3 weeks vacation

401(k) with matching

Tuition reimbursement

Student loan repayment

Life insurance

Disability coverage

Employee Assistance Plan

Job summary

RTX Collins Aerospace seeks an Electrical Engineer II to join the Avionics Network Hardware team. You will design digital hardware and support product recertification, cost reductions, and field troubleshooting to improve aircraft networking solutions.

The role focuses on high-bandwidth avionics hardware, FPGA/ASIC interfaces, and memory/bus technologies. On-site collaboration with a multidisciplinary team is expected.

Qualifications

• STEM degree required with 2+ years experience or advanced degree.
• Experience in Electrical Engineering role.
• Onsite work requirement noted in posting.

Responsibilities

• Design circuit/board layout to support product lifecycle.
• Support product recertification (TSO/PMA) driven by changes.
• Identify cost savings to the standard product cost.
• Support production to achieve on-time delivery goals.
• Resolve OEM customer issues and field equipment troubleshooting.
• Evaluate part change notifications (obsolescence, end of life).
• Evaluate designs for DTC, DFM, DFT.
• Requirements capture, tracing, and verification.

Skills

Electrical engineering

Digital design principles

Problem solving

Documentation

Communication

Education

B.S. in STEM

Tools

Schematic capture

PCB design

Signal integrity analysis

DO-160 testing

Ethernet/I2C/USB/LVDS/SERDES

Lab troubleshooting

Job description

RTX Collins Aerospace seeks an Electrical Engineer II to join the Avionics Network Hardware team. You will design digital hardware and support product recertification, cost reductions, and field troubleshooting to improve aircraft networking solutions.

The role focuses on high-bandwidth avionics hardware, FPGA/ASIC interfaces, and memory/bus technologies. On-site collaboration with a multidisciplinary team is expected.