Associate Director: Microelectronics Packaging & Strategy

Raytheon; McKinney (TX); On-site; USD 157,000 - 299,000; Full time

Benefits offered by this job

Relocation eligible

Relocation assistance

Benefits package

Job summary

RTX is seeking a multi-disciplinary Engineering Project Leader focused on microelectronics packaging and 2.5D/3D heterogeneous integration to increase RF/mixed-signal subsystem density. You will provide technical direction during CRAD programs and coordinate IRAD initiatives across Raytheon sites.

You will collaborate with engineers across disciplines, drive customer-focused proposals, and mentor teammates while managing portfolio investments and travel to customer sites.

Qualifications

• Bachelor’s degree in Science, Technology, Engineering, or Mathematics (STEM) and minimum of 12 years of prior relevant experience.
• Experience with microelectronics design and development with emphasis on microelectronics packaging.
• Experience writing and/or leading responses to solicitations (RFIs, RFPs, etc.), including white papers and/or proposals.
• Experience managing program cost, schedule, and technical performance.
• Experience leading cross-functional teams including, but not limited to PI, engineering, contracts, finance, procurement/supply chain, and/or manufacturing/operations.
• Active and transferable Top Secret U.S. government issued security clearance is required prior to start date with the ability to obtain a Top Secret/SCI clearance and/or program access after start.

Responsibilities

• Work with Senior Leadership to develop capture strategies for new business and lead project capture and management.
• Interact with customers to develop microelectronic packaging opportunities, white papers and proposals.
• Align program teams to customer priorities through requirements development and risk management.
• Lead trade studies on 2.5D and 3D integration architectures to meet system needs.
• Oversee interposer fabrication and assembly strategy across Raytheon sites and suppliers.
• Prepare technical white papers and proposal volumes with cross-organizational collaboration.

Skills

Microelectronics packaging

RF system design

Proposal writing

Program management

Cross-functional leadership

Education

Bachelor’s degree in STEM

Tools

CAD tools

Job description

RTX is seeking a multi-disciplinary Engineering Project Leader focused on microelectronics packaging and 2.5D/3D heterogeneous integration to increase RF/mixed-signal subsystem density. You will provide technical direction during CRAD programs and coordinate IRAD initiatives across Raytheon sites.

You will collaborate with engineers across disciplines, drive customer-focused proposals, and mentor teammates while managing portfolio investments and travel to customer sites.