Senior Microelectronics Packaging Leader (2.5D/3D)

Prattwhitney; North Tewksbury (MA); On-site; USD 157,000 - 299,000; Full time

Benefits offered by this job

Medical

Dental

Vision

Life insurance

Short-term disability

Long-term disability

401(k) match

Flexible spending accounts

Flexible work schedules

Employee assistance program

Employee Scholar Program

Parental leave

Paid time off

Holidays

Job summary

RTX is seeking an Engineering Project Leader to guide microelectronics packaging across 2.5D and 3D heterogeneous integration for RF and mixed-signal subsystems. This onsite role can be located in Tewksbury, MA, McKinney, TX, or Goleta, CA, with responsibilities spanning program capture, technical direction, and cross-functional collaboration.

You will lead trade studies, mentor engineers, and drive proposals while managing portfolio investments. A Top Secret clearance is required to start.

Qualifications

• Bachelor’s degree in STEM with 12+ years of relevant experience.
• Experience in microelectronics packaging design and development.
• Experience writing/leading responses to solicitations (RFIs, RFPs).
• Experience managing program cost, schedule, and technical performance.
• Experience leading cross-functional teams across multiple functions.
• Active and transferable Top Secret clearance required on day 1.

Responsibilities

• Develop capture strategies and lead project capture and management.
• Interact with customers to develop packaging opportunities, white papers and proposals.
• Align program teams to customer priorities through requirements and risk mitigation.
• Lead trade studies for 2.5D/3D integration architectures.
• Oversee interposer fabrication and assembly strategy across sites and suppliers.
• Mentor and train RF/mixed-signal packaging engineers.
• Manage portfolio investment budgets and travel for engagements.

Skills

Microelectronics design

Packaging

Program management

Cross-functional leadership

RF design

IRAD management

Security clearance

Education

Bachelor's degree in STEM

Job description

RTX is seeking an Engineering Project Leader to guide microelectronics packaging across 2.5D and 3D heterogeneous integration for RF and mixed-signal subsystems. This onsite role can be located in Tewksbury, MA, McKinney, TX, or Goleta, CA, with responsibilities spanning program capture, technical direction, and cross-functional collaboration.

You will lead trade studies, mentor engineers, and drive proposals while managing portfolio investments. A Top Secret clearance is required to start.