Senior Associate Director, Microelectronics Packaging

RTX; Tewksbury (MA); On-site; USD 157,000 - 299,000; Full time

Benefits offered by this job

Relocation assistance

Medical insurance

Dental insurance

Vision insurance

Life insurance

401(k) match

Paid time off

Job summary

RTX, a leading aerospace and defense company, seeks an Engineering Project Leader to guide the strategy and development of a microelectronics packaging portfolio, focusing on 2.5D and 3D heterogeneous integration to increase RF/mixed-signal density. The role is onsite in multiple U.S.

locations and requires a Top Secret clearance. The candidate will provide technical direction across CRAD programs, coordinate IRAD projects, and mentor teams while collaborating across Raytheon entities to mature

Qualifications

• Experience with microelectronics design and development with emphasis on microelectronics packaging.
• Evidence of leading responses to solicitations (RFIs, RFPs) and producing white papers/proposals.
• Experience managing program cost, schedule, and technical performance.
• Ability to lead cross-functional teams including engineering, contracts, finance, and manufacturing.

Responsibilities

• Develop capture strategies and lead capture and project management.
• Interact with customers to identify microelectronic packaging opportunities and write proposals.
• Align program teams to customer priorities and manage risk mitigation while pursuing opportunities.
• Lead trade studies on 2.5D/3D integration for RF/mixed-signal systems.
• Direct interposer fabrication/assembly strategies across sites and suppliers.
• Lead white papers and proposal volumes through cross-organizational collaboration.
• Mentor and train RF, mixed-signal, and packaging teams.
• Manage portfolio investment budget and report on progress.
• Travel for customer engagements.

Skills

microelectronics packaging

RF/mixed-signal design

cross-functional leadership

proposal development

Education

Bachelor’s degree in STEM

Job description

RTX, a leading aerospace and defense company, seeks an Engineering Project Leader to guide the strategy and development of a microelectronics packaging portfolio, focusing on 2.5D and 3D heterogeneous integration to increase RF/mixed-signal density. The role is onsite in multiple U.S.

locations and requires a Top Secret clearance. The candidate will provide technical direction across CRAD programs, coordinate IRAD projects, and mentor teams while collaborating across Raytheon entities to mature