IC Package Mechanical FEA Engineer (R&D)

Broadcom; San Jose (CA); Vor Ort; USD 108.000 - 173.000; Vollzeit

Benefits dieser Stelle

401K with company match

Employee Stock Purchase Program (ESPP)

Paid holidays

Vacation time

Zusammenfassung

Broadcom is seeking an experienced package mechanical FEA engineer for very large and complex packages used in AI, HPC, networking, and 5G devices. You will join a worldwide R&D team to design high-performance package designs for ASICs and influence mechanical trade-offs across multiple domains.

You will work on advanced co-packaged technology and multi-chip-module packaging, collaborating with design, reliability, and manufacturing teams to optimize warpage, stress, thermal, and electrical

Qualifikationen

• Bachelor’s in Mechanical Engineering with 8+ years FEA experience
• Master’s in Mechanical Engineering with 6+ years FEA experience
• PhD in Mechanical Engineering with 3+ years FEA experience
• Ability to evaluate numerical simulation results against first principles
• Ability to calibrate modeling with empirical data
• Experience with Ansys Classic/Mechanical preferred

Aufgaben

• Design responsibility for mechanical design aspects of ASIC packages
• Use advanced FEA to quantify and optimize reliability and manufacturing
• Measure and experiment to validate understanding and improve model accuracy
• Collaborate closely with package designers, reliability and manufacturing partners
• Schedule and track your work across 4+ projects simultaneously
• Create presentations for and present to engineers, managers, senior management, customers, and vendors
• Document design rules and guidelines

Kenntnisse

FEA modeling

Mechanical design

Presentation skills

Ausbildung

Bachelor's in Mechanical Engineering

Master's in Mechanical Engineering

PhD in Mechanical Engineering

Tools

Ansys Classic/Mechanical

Jobbeschreibung

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Job Description:

Broadcom is seeking an experiencedpackagemechanical FEAengineerforvery-large and complexpackages for industry-leading ASICs. You will be part of a worldwide R&D team developing high-performancepackagedesigns for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. You’ll have exposure to emergingpackage integration technologies, such as co-packaged fiber-optic transceivers and connectorsand complex chip stacking (3DIC, hybrid copper bonding, heterogeneous integration, etc). Also, you will develop and optimize unique multi-chip-module (MCM) packages and mainstream flip-chip BGA (FCBGA) packages. You’ll have the opportunity to collaborate with the R&D and manufacturing teams to influence the mechanical design of new ASICs, and make engineering trade offs with warpage, stress, reliability, cost,thermal andelectrical performance, etc..

RESPONSIBILITIES:

• Design responsibility for mechanical design aspects of ASIC packages

• Use advanced FEA to quantify and optimize reliability and manufacturing

• Measure and experiment to validate understanding and improve model accuracy

• Collaborate closely with package designers, reliability and manufacturing partners (internal and external)

• Schedule, prioritize, & track your work across 4+ projects simultaneously

• Create presentations for and present to various audiences : engineers, managers, senior management, customers, and vendors

• Document design rules and guidelines

EDUCATION/EXPERIENCE & REQUIREMENTS:

• Bachelors in Mechanical Engineering or similar field and 8+ years of experience in FEA modeling or Masters in Mechanical Engineering or similar field and 6+ years of experience in FEA modeling or PhD in Mechanical Engineering or similar field and 3+ years of experience in FEA modeling.

• Ability to evaluate complicated numerical simulation results against first principles such as strength of materials solutions

• Ability to calibrate modeling and results with existing empirical data

• Perform mechanical testing and measurement

• Devise lab scale tests to validate analyses

• Seek mechanical solutions at the intersection of manufacturing limitations, required reliability and customer expectations

• Ansys Classic/Mechanical experience is preferred. Equivalent tool is OK

• Cooperate with our world-wide team (multiple time zones), including co-designwith internal team members and external (Vendor) designers

• Self-management and organization skills

• Presentation and technical documentation skills

Additional Job Description:

Compensation and Benefits

The annual base salary range for this position is$108,000 - $172,800.

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.