Advanced Packaging TD Intern: AI-Driven Analysis

Micron Technology, Inc.; Boise (ID); On-site; USD 25,000 - 39,000; Full time

Benefits offered by this job

Medical plan

Dental plan

Vision plan

Paid time off

Paid holidays

Job summary

Micron Technology, Inc. in Boise, Idaho, is seeking an Advanced Packaging TD Process Intern to collaborate with engineers on hybrid bonding, micro bump, TSV, and thermal management technologies.

You will gain hands-on experience in DoE design, data analysis, and problem solving while optimizing production processes. The role emphasizes structured problem solving, cross-functional collaboration, and applying AI/code-assisted methods to support engineering analysis and process development.

Qualifications

• Currently enrolled in a Master’s degree or PhD in a semiconductor-related field with expected graduation Fall 2027 to Summer 2028.
• Experience with data extraction, statistical analysis, and technical reporting using JMP or comparable analytics tools.
• Ability to collaborate and communicate technical findings across multi-functional teams.
• Experience using AI, Code Assist, or Agent-based solutions for technical analysis, engineering workflows, or related applications.

Responsibilities

• Lead structured problem-solving activities using Kepner-Tregoe (KT) methods to address process and yield challenges.
• Define, complete, and analyze Design of Experiments (DoE) for advanced packaging and interconnect process development.
• Analyze process, line-monitoring, and yield data; develop new monitoring methods and critical metrics to support process optimization.
• Present technical findings and collaborate with engineering teams across sites and functional areas.
• Apply AI and Code Assist to develop Agent-based solutions that enhance data analysis, engineering workflows, or process monitoring.

Skills

Data extraction

Statistical analysis

Technical reporting

Cross-functional collaboration

AI/Code Assist experience

Project management

Education

Master's or PhD in semiconductor-related field

Tools

JMP

Job description

Micron Technology, Inc. in Boise, Idaho, is seeking an Advanced Packaging TD Process Intern to collaborate with engineers on hybrid bonding, micro bump, TSV, and thermal management technologies.

You will gain hands-on experience in DoE design, data analysis, and problem solving while optimizing production processes. The role emphasizes structured problem solving, cross-functional collaboration, and applying AI/code-assisted methods to support engineering analysis and process development.