Principle Packaging Engineer

IC Resources; San Francisco (CA); Hybrid; USD 180,000 - 260,000; Full time

Benefits offered by this job

Performance bonus

Flexible hybrid working

Job summary

IC Resources is seeking a Principal Packaging Engineer to lead the development of advanced heterogeneous integration and packaging technologies for cutting-edge compute platforms, including 2.5D/3D architectures and optical integration.

You will work with foundries, OSATs and cross-functional teams to shape packaging strategy and roadmaps, while performing thermal, mechanical and reliability analyses and implementing DfM/DFT methodologies.

Qualifications

• MS or PhD in a relevant engineering discipline.
• 10+ years of semiconductor packaging experience.
• Expertise in 2.5D/3D packaging, heterogeneous integration, interposers, RDL, advanced substrates, and optical integration.
• Experience with thermal, mechanical and reliability modelling.
• Proven track record delivering complex semiconductor packaging solutions.
• Experience collaborating with foundries, OSATs and external technology partners.

Responsibilities

• Leading the development of advanced 2.5D and 3D packaging architectures.
• Defining heterogeneous integration strategies across silicon photonics, CMOS and other advanced semiconductor technologies.
• Developing interposers, redistribution layers (RDL), advanced substrates and optical integration solutions.
• Driving packaging solutions for co-packaged and high-bandwidth optical systems.
• Performing thermal, mechanical and reliability analysis to optimise package performance.
• Implementing Design for Manufacturability (DfM) and Design for Test (DfT) methodologies.
• Working closely with foundries, OSAT partners and multidisciplinary engineering teams.
• Influencing long-term packaging strategy and future technology roadmaps.

Skills

2.5D/3D packaging

Heterogeneous integration

Interposers

RDL

Optical integration

Thermal modelling

Mechanical modelling

Reliability modelling

Collaboration with foundries/OSATs

Education

MS or PhD in a relevant engineering discipline

Job description

Principal Packaging Engineer – Advanced Packaging & Heterogeneous Integration

Our client is an innovative deep-tech company developing next-generation computing technologies that combine photonics and semiconductor engineering to deliver unprecedented performance for AI, high-performance computing, and advanced security applications.

They are seeking a Principal Packaging Engineer to lead the development of advanced heterogeneous integration and packaging technologies for cutting-edge compute platforms.

This is a unique opportunity to shape packaging architecture from the ground up, working at the forefront of silicon photonics, advanced semiconductor packaging, and high-performance system integration.

The Role

You will be responsible for:

• Leading the development of advanced 2.5D and 3D packaging architectures.
• Defining heterogeneous integration strategies across silicon photonics, CMOS and other advanced semiconductor technologies.
• Developing interposers, redistribution layers (RDL), advanced substrates and optical integration solutions.
• Driving packaging solutions for co-packaged and high-bandwidth optical systems.
• Performing thermal, mechanical and reliability analysis to optimise package performance.
• Implementing Design for Manufacturability (DfM) and Design for Test (DfT) methodologies.
• Working closely with foundries, OSAT partners and multidisciplinary engineering teams.
• Influencing long-term packaging strategy and future technology roadmaps.

Requirements

We're interested in speaking with engineers who have:

• An MS or PhD in a relevant engineering discipline.
• 10+ years of semiconductor packaging experience.
• Strong expertise in:
• Advanced Packaging (2.5D / 3D)
• Heterogeneous Integration
• Interposers, RDL and advanced substrates
• Optical integration technologies
• Experience with thermal, mechanical and reliability modelling.
• A proven background delivering complex semiconductor packaging solutions.
• Experience collaborating with foundries, OSATs and external technology partners.

What's on Offer

• Highly competitive compensation package
• Performance bonus
• Flexible hybrid workingOpportunity to work on breakthrough technologies shaping the future of computing