Advanced Packaging Engineer

DensityAI; Mountain View (CA); On-site; USD 200,000 - 350,000; Full time

Benefits offered by this job

Equity grant

Medical, dental, vision benefits

401(k)

Standard PTO

Job summary

DensityAI in Mountain View, California, is seeking a Packaging Engineer to own various aspects including Design Layout and thermomechanical considerations in packaging. You'll collaborate with chip-design and software teams for DensityAI's AI accelerator program.

This role requires exceptional expertise in advanced packaging design with at least 10 years of experience working on high-performance designs. The position offers a competitive salary range of $200,000 - $350,000 USD, as well as additional equity and benefits.

Qualifications

• 10+ years of experience on very high performance designs at advanced packaging.
• Hands-on with Multi-die packaging tools including 2.5D/3D.
• Exceptional abilities across full advanced packaging design.

Responsibilities

• Own different aspects of Packaging including Design Layout and SI/PI.
• Use and develop AI-assisted tools to accelerate package design.

Skills

Advanced packaging design

High performance designs

Industry-standard packaging tools

Collaboration with architects

Job description

ITAR Notice: This role involves access to ITAR-controlled information. Applicants must be U.S. persons (U.S. citizens, U.S. permanent residents, asylees, or refugees) per 22 CFR 120.62.

About The Role

Own different aspects of Packaging including Design Layout, SI/PI and Thermo-mechanical aspects. Work with chip-design and software teams driving DensityAI's AI accelerator program from first silicon through scale-out.

What you'll do

• Own different aspects of Packaging including Design Layout, SI/PI and Thermo-mechanical aspects
• Use and develop AI-assisted tool flows to accelerate package design and signoff timelines

What we're looking for

• Exceptional abilities across the full advanced packaging design and tradeoffs
• 10+ years of experience on very high performance designs at advanced packaging like SIP, CoWoS, EMIB and other interposer technologies
• Hands-on with industry-standard Packaging tools and flows for Multi-die packaging (including 2.5D/3D)
• Demonstrated ability to work closely with architects to create right packaging solutions and sign off complex packaging solutions
• (Optional) DFT-aware packaging design, RTL and PD flows

Compensation

Final offers depend on level, location, and skills relevant to the role. Additional compensation: equity grant per company guidelines; medical / dental / vision; 401(k); standard PTO.

Visa Sponsorship

DensityAI sponsors qualified candidates for H-1B, O-1, TN, E-3, and other employment-based visas, and we welcome applicants on F-1 OPT and STEM-OPT. Work authorization is required at start; we provide immigration support to secure or transfer status.

Export Controls

Aspects of this role may involve access to information subject to U.S. export controls (EAR/ITAR). We may discuss licensing or scope adjustments during the interview.

Equal Opportunity

DensityAI is an Equal Opportunity Employer. We do not discriminate on the basis of race, color, religious creed, national origin, ancestry, physical or mental disability, medical condition, genetic information, marital status, sex, gender, gender identity, gender expression, age (40+), sexual orientation, military or veteran status, pregnancy, or any other status protected by law. We comply with the California CROWN Act and provide reasonable accommodations on request.

Full compensation packages are based on candidate experience and relevant certifications.

California pay range

$200,000 - $350,000 USD