Advanced Packaging Metrology Engineer for Process & Yield

Intel Corporation; Phoenix (AZ); On-site; USD 134,000 - 189,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Vacation

Job summary

Intel Corporation seeks a Metrology Equipment Engineer to advance process control for Thermal Compression Bonding, developing metrology systems and inspection equipment for advanced packaging. You will lead measurement method development, calibrations, and data-driven improvements across lab and manufacturing environments.

You will apply DOE, MSA, and signal-quality analyses to enhance repeatability, reliability, and yield, collaborating with packaging technology and process engineering teams to

Qualifications

• Minimum education: Bachelor’s with 4+ years, Master’s with 3+ years, or PhD with 1+ year in engineering fields.
• Experience in metrology systems development and calibration in lab/manufacturing environments.
• Strong knowledge of measurement system analysis (MSA) including bias, linearity, precision, and reproducibility.
• Experience with electrical tests (continuity, resistance, leakage) and optical metrology.
• Experience with data analysis tools (Python, Excel, SQL).

Responsibilities

• Optimize metrology capabilities across lab and manufacturing environments.
• Develop and qualify measurement processes, calibration methods, and correlation techniques.
• Apply DOE and statistical analysis to improve repeatability and tool correlation.
• Collaborate with suppliers and internal teams to ensure data integrity and traceability.
• Document findings through reports and qualification summaries.

Skills

Metrology

Mathematical analysis

Data analysis

Electrical measurements

Optical metrology

Machine vision

Python

Excel

SQL

Education

Bachelor's degree

Master's degree

PhD

Tools

Python

Excel

SQL

Calibration equipment

Job description

Intel Corporation seeks a Metrology Equipment Engineer to advance process control for Thermal Compression Bonding, developing metrology systems and inspection equipment for advanced packaging. You will lead measurement method development, calibrations, and data-driven improvements across lab and manufacturing environments.

You will apply DOE, MSA, and signal-quality analyses to enhance repeatability, reliability, and yield, collaborating with packaging technology and process engineering teams to