Advanced Microwave Subsystem Assembler III

Honeywell Aerospace; San Jose (CA); On-site; USD 40,000 - 50,000; Full time

Benefits offered by this job

Medical, dental, vision insurance

Life insurance

401(k) match

Disability coverage

Educational assistance

Paid holidays

Paid time off

Job summary

Honeywell Aerospace in San Jose, CA is seeking an Assembler III to support advanced microwave subsystems through mechanical box builds and hand soldering per IPC 610. You will contribute to daily production goals and maintain detailed rework records within a team focused on mission-critical applications.

The role requires at least 3 years in microelectronic, RF, hybrid or semiconductor assembly, the ability to use small tools and a microscope, and eligibility to obtain a U.S. security clearance.

Qualifications

• At least 3 years prior work experience in microelectronic, RF, hybrid and/or semiconductor assembly.
• Ability to use small hand tools such as tweezers and torque drivers and experience working under a microscope.
• Ability to obtain and maintain security clearance.

Responsibilities

• Work in a production environment to provide mechanical assembly support on complex microwave subsystems, meeting daily output goals established by your lead.
• Work in a production environment to build circuit card assemblies including manual soldering and conformal coating after soldering.
• Carefully follow production documentation and processes, including keeping detailed records of rework performed.
• Actively participate in daily production meetings.

Skills

Hand soldering

Microwave assembly

Use small hand tools

Soldering under microscope

Tools

Microscope

Torque drivers

Soldering equipment

Job description

Honeywell Aerospace in San Jose, CA is seeking an Assembler III to support advanced microwave subsystems through mechanical box builds and hand soldering per IPC 610. You will contribute to daily production goals and maintain detailed rework records within a team focused on mission-critical applications.

The role requires at least 3 years in microelectronic, RF, hybrid or semiconductor assembly, the ability to use small tools and a microscope, and eligibility to obtain a U.S. security clearance.