3D IC Applications Engineer - Hybrid Role with Global Travel

Siemens EDA (Siemens Digital Industries Software); Santa Clara (CA); Hybrid; USD 110,000 - 170,000; Full time

Benefits offered by this job

Flexible work model

Travel opportunities

Job summary

Siemens EDA is seeking an Applications Engineer within Technology Solutions Sales in the United States. You will support consultative sales efforts and lead technical wins for Innovator 3D IC Layout, Innovator3D IC Integrator, Xpedition, Calibre, HyperLynx, and related tools.

You will deliver presentations, run demos, develop flows, and prototype emerging 3DIC solutions while traveling domestically and internationally and collaborating with global teams.

Qualifications

• MSEE/BSEE with 4+ years design experience.
• Package design experience; interposer layout desirable.
• IC design experience is a plus.
• Proficiency with packaging tools and data formats.
• Familiarity with signal/power integrity tools.
• Experience with Siemens Calibre DRC/LVS is highly desirable.
• Strong MS Word/Excel/PowerPoint; scripting in Python/Tcl/Perl.

Responsibilities

• Deliver technical presentations and product demos.
• Benchmarks and solution development to win designs.
• Architect and prototype 3DIC flows with scripting.
• Collaborate with global peers and travel as needed.
• Support consultative sales with design wins.

Skills

Communication

Team collaboration

Independent work

Travel willingness

Technical debugging

Education

MSEE/BSEE

Tools

Cadence APD/SiP

Siemens Xpedition/i3DL

Cadence OrbitIO/ISP

Synopsys 3DIC Compiler

Excel

Verilog

LEF/DEF

GDS

OASIS

HyperLynx

Sigrity

SIWave

ADS

Calibre DRC/LVS/3DSTACK

Python

Tcl

Perl

VBScript

Windows/Linux OS

Job description

Siemens EDA is seeking an Applications Engineer within Technology Solutions Sales in the United States. You will support consultative sales efforts and lead technical wins for Innovator 3D IC Layout, Innovator3D IC Integrator, Xpedition, Calibre, HyperLynx, and related tools.

You will deliver presentations, run demos, develop flows, and prototype emerging 3DIC solutions while traveling domestically and internationally and collaborating with global teams.