Material Science jobs in Singapore

• Develop and refine CMP processes for planarizing dielectric and metal layers (e.g., copper, dielectric, etc.) in advanced substrate manufacturing.
• Optimize polishing recipes, pad/slurry combinations, and process parameters to achieve planarity, low defectivity, and target thickness.

• Define equipment specifications and validate CMP tools.
• Monitor and maintain CMP tool performance, including pad conditioning, slurry delivery systems, and endpoint detection technologies.

• Investigate and resolve CMP-related defects (e.g., dishing, erosion, scratching, delamination).
• Implement process monitoring techniques like thickness metrology (e.g., ellipsometry, profilometry) and defect inspection.

• Collaborate with upstream and downstream process owners (e.g., plating, lithography, etching) to ensure seamless integration.
• Support the development of process flows for advanced packaging substrates including SAP/ Damascene, ABF/PI/PID-based technologies.

• Perform statistical analysis (e.g., DOE, SPC) to identify and control critical process parameters.
• Document standard operating procedures (SOPs), work instructions, and control plans.

• Work closely with design, product engineering, equipment vendors, and manufacturing teams to support process scale-up and new product introduction (NPI).
• Assist with customer qualifications and reliability testing as needed.

Perform any other ad-hoc duties as assigned by the Manager, as required to support the team and organizational goals.

• PhD or Master’s degree in Materials Science, Chemical Engineering, Mechanical Engineering, or a related field.
• 5–10+ years of experience in CMP process development in semiconductor packaging, wafer fabrication, or substrate manufacturing.
• Hands‑on experience with CMP tools.
• Solid understanding of substrate technologies such as Damascene, SAP, ABF build‑up, or Embedding.

• Experience with defect analysis tools (e.g., optical inspection, SEM, AFM).
• Familiarity with process integration for advanced packaging (e.g., 2.5D/3D IC, interposers).
• Knowledge of slurry chemistry, pad materials, and post‑CMP cleaning processes.
• Strong analytical, documentation, and problem‑solving skills.
• Good communication and teamwork in a cross‑functional environment.