Senior PVD Packaging Technologist for Chiplet Solutions

Applied Materials; Singapore; On-site; SGD 80,000 - 120,000; Full time

Job summary

A leading materials engineering company in Singapore is seeking a PVD Solutions Engineer to act as a technical owner for advanced packaging applications. The successful candidate will collaborate with customers to deliver robust solutions while driving extensive qualification programs tailored to customer needs. This position requires over 10 years of engineering experience in semiconductor equipment and strong knowledge of PVD processes. Applicants with a strong background in materials science or engineering are preferred, along with superior problem-solving capabilities.

Benefits

Supportive work culture

Career development opportunities

Health and wellbeing programs

Qualifications

• 10+ years in semiconductor equipment/process engineering.
• Proven success enabling PVD solutions with OSATs and design houses.
• Experience in advanced packaging technologies like FO-WLP.

Responsibilities

• Act as technical owner for PVD solutions.
• Lead qualification programs with metrics and acceptance gates.
• Coordinate with engineering and quality teams for solutions.

Skills

PVD experience

Communication skills

Problem-solving

Education

Bachelor’s or Master’s in Materials Science, Physics, Chemical Engineering

PhD preferred

Tools

SPC

DOE

Metrology

Yield analytics

Job description

A leading materials engineering company in Singapore is seeking a PVD Solutions Engineer to act as a technical owner for advanced packaging applications. The successful candidate will collaborate with customers to deliver robust solutions while driving extensive qualification programs tailored to customer needs. This position requires over 10 years of engineering experience in semiconductor equipment and strong knowledge of PVD processes. Applicants with a strong background in materials science or engineering are preferred, along with superior problem-solving capabilities.