Wafer Bumping Equipment Engineer — PVD/Descum

COPPERCO TALENT SERVICES PTE. LTD.; Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

CopperCo Talent Services Pte. Ltd. is seeking an Engineer to oversee wafer bumping equipment including PVD, Descum and Wet processes in a Singapore facility. The role focuses on startup, installation, maintenance, and reliability improvements across PM/CM activities.

The ideal candidate has 3+ years in semiconductor equipment engineering, strong troubleshooting, and capable vendor negotiations. Expect involvement in smart factory integration, ESD control, and mentoring junior staff.

Qualifications

• Bachelor’s degree in Engineering (Mechanical, Electrical or Electronics).
• Minimum 3 years of equipment engineering experience, semiconductor preferred.
• Hands-on experience with PM/CM, reliability, ESD controls, and automated factory systems.
• Strong analytical, troubleshooting, communication, and vendor negotiation skills.

Responsibilities

• Equipment Maintenance & Operations: Lead equipment startup, installation, and maintenance for PVD, Descum, and Wet systems. Plan and execute CM/PM to ensure high reliability.
• Technical Troubleshooting & Optimization: Conduct in-depth analyses, drive continuous improvement, upgrades and capacity optimization to maximize OEE.
• Smart Factory & Facility Integration: Set up and monitor ESD systems; support AMR and CDS automation.
• Vendor & Spare Parts Management: Track and order parts; negotiate with suppliers on service, quotes, and inventory.
• Documentation & Compliance: Conduct risk assessments; generate OPLs and procedures for QMS compliance.
• Team Leadership & Mentorship: Lead equipment support team; provide training and guidance to juniors.

Skills

Equipment maintenance

Troubleshooting

PM/CM execution

ESD controls

AMR familiarity

CDS familiarity

Vendor negotiation

Team leadership

Communication

Education

Bachelor’s degree in Engineering

Tools

AMR systems

CDS

Job description

CopperCo Talent Services Pte. Ltd. is seeking an Engineer to oversee wafer bumping equipment including PVD, Descum and Wet processes in a Singapore facility. The role focuses on startup, installation, maintenance, and reliability improvements across PM/CM activities.

The ideal candidate has 3+ years in semiconductor equipment engineering, strong troubleshooting, and capable vendor negotiations. Expect involvement in smart factory integration, ESD control, and mentoring junior staff.