Engineer – Wafer Bumping Equipment

COPPERCO TALENT SERVICES PTE. LTD.; Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

CopperCo Talent Services Pte. Ltd. is seeking an Engineer to oversee wafer bumping equipment including PVD, Descum and Wet processes in a Singapore facility. The role focuses on startup, installation, maintenance, and reliability improvements across PM/CM activities.

The ideal candidate has 3+ years in semiconductor equipment engineering, strong troubleshooting, and capable vendor negotiations. Expect involvement in smart factory integration, ESD control, and mentoring junior staff.

Qualifications

• Bachelor’s degree in Engineering (Mechanical, Electrical or Electronics).
• Minimum 3 years of equipment engineering experience, semiconductor preferred.
• Hands-on experience with PM/CM, reliability, ESD controls, and automated factory systems.
• Strong analytical, troubleshooting, communication, and vendor negotiation skills.

Responsibilities

• Equipment Maintenance & Operations: Lead equipment startup, installation, and maintenance for PVD, Descum, and Wet systems. Plan and execute CM/PM to ensure high reliability.
• Technical Troubleshooting & Optimization: Conduct in-depth analyses, drive continuous improvement, upgrades and capacity optimization to maximize OEE.
• Smart Factory & Facility Integration: Set up and monitor ESD systems; support AMR and CDS automation.
• Vendor & Spare Parts Management: Track and order parts; negotiate with suppliers on service, quotes, and inventory.
• Documentation & Compliance: Conduct risk assessments; generate OPLs and procedures for QMS compliance.
• Team Leadership & Mentorship: Lead equipment support team; provide training and guidance to juniors.

Skills

Equipment maintenance

Troubleshooting

PM/CM execution

ESD controls

AMR familiarity

CDS familiarity

Vendor negotiation

Team leadership

Communication

Education

Bachelor’s degree in Engineering

Tools

AMR systems

CDS

Job description

Engineer – Wafer Bumping Equipment (PVD / Descum / Wet)

Responsibilities

• Equipment Maintenance & Operations: Lead equipment startup, installation, and maintenance for PVD, Descum, and Wet systems. Plan and execute Corrective Maintenance (CM) and Preventive Maintenance (PM) to ensure high reliability.

• Technical Troubleshooting & Optimization: Conduct in-depth technical and failure mode analyses. Drive continuous improvement, upgrades, and capacity optimization projects to maximize Overall Equipment Effectiveness (OEE).

• Smart Factory & Facility Integration: Set up and monitor Electrostatic Discharge (ESD) systems. Support and maintain Smart Factory automation systems, including Autonomous Mobile Robots (AMR) and Chemical Delivery Systems (CDS).

• Vendor & Spare Parts Management: Track and order spare parts using internal systems. Negotiate with external suppliers regarding service support, parts inquiries, quotations, and inventory levels.

• Documentation & Compliance: Conduct risk assessments for existing and new equipment. Generate One-Point Lessons (OPLs) and operational procedures to support Quality Management System (QMS) compliance.

• Team Leadership & Mentorship: Lead and direct the equipment support team, providing training and technical guidance to junior personnel.

Requirements

• Education: Bachelor’s degree in Engineering (preferably Mechanical, Electrical, or Electronics).

• Experience: Minimum 3 years of relevant equipment engineering experience, preferably in the semiconductor industry (Wafer Bumping / PVD / Descum / Wet equipment).

• Technical Familiarity: Hands‑on experience with equipment reliability, PM/CM execution, ESD controls, and automated factory systems (AMR/CDS).

• Core Competencies: Strong analytical, troubleshooting, communication, and vendor negotiation capabilities.

  We regret that only shortlisted candidates will be notified.