Underfill Process R&D Engineer – Advanced Packaging

UTAC; Singapore; On-site; SGD 90,000 - 150,000; Full time

Job summary

UTAC in Singapore is seeking an Underfill Process Development Engineer to design, optimize and qualify capillary underfill and advanced dispensing processes for flip chip, 2.5D and SiP packages. You will work closely with customers, material suppliers and manufacturing teams to deliver robust underfill solutions that meet quality and reliability goals.

The role focuses on DOE-driven experimentation, process characterization and optimization, with emphasis on material evaluation and reliability

Qualifications

• Bachelor's degree in Chemical Engineering, Materials Science Engineering or Mechanical Engineering.
• Master's degree preferred.
• 3–10 years in semiconductor packaging process development is expected.

Responsibilities

• Develop and optimize capillary underfill and advanced dispensing processes for semiconductor packages.
• Establish process windows for underfill dispense, flow, cure, and post-cure steps.
• Evaluate new underfill materials and dispensing technologies.
• Define and execute DOE to improve process capability and performance.
• Develop processes for advanced packaging applications including Flip Chip, 2.5D and SiP.

Skills

Underfill dispensing

DOE & statistics

Process characterization

Education

Chemical Engineering

Materials Science Engineering

Mechanical Engineering

Tools

Asymtek dispenser

NSW dispenser

Leading dispensers

Job description

UTAC in Singapore is seeking an Underfill Process Development Engineer to design, optimize and qualify capillary underfill and advanced dispensing processes for flip chip, 2.5D and SiP packages. You will work closely with customers, material suppliers and manufacturing teams to deliver robust underfill solutions that meet quality and reliability goals.

The role focuses on DOE-driven experimentation, process characterization and optimization, with emphasis on material evaluation and reliability