R & D Engineer – Underfill/Cure

PEOPLE PROFILERS PTE. LTD.; Singapore; On-site; SGD 61,000 - 73,000; Full time

Job summary

PEOPLE PROFILERS PTE. LTD. is seeking an experienced engineer to design, qualify and optimize advanced underfill processes for high-density packaging, aligning with the technology roadmap and cost targets.

The role focuses on CoWoS PKG product family and CPO, including dispensing and material evaluation, void control, and reliability improvements, with leadership of assigned projects and active customer collaboration.

Qualifications

• Bachelor’s degree or higher in engineering or science.
• 3+ years R&D or mass production experience in underfill/dispensing/encapsulation technology.
• Proven experience driving customer development programs and managing customer requirements.
• Fundamental understanding of advanced semiconductor packaging, underfill fluid dynamics, void-free encapsulation, and thermal-mechanical stress control.

Responsibilities

• Design, qualify, and optimize advanced underfill processes to meet design rules and high-density packaging requirements.
• Advanced Underfill Process development for CoWoS PKG product family and CPO.
• Dispensing & Material Evaluation / Qualification
• Void & Fillet Control
• Failure Analysis & Reliability Enhancement
• Customer Development & Technology Transfer
• Lead assigned projects
• Yield Improvement & Yield FA

Skills

DoE

Failure Analysis

Technical data reporting

Technical presentations

English technical writing

Education

Bachelor’s degree or higher in engineering or science

Tools

Underfill equipment (dispenser)

Cure oven

Epoxy/resin materials

Inspection/reliability tools

Job description

• To design, qualify, and optimize advanced underfill processes (e.g., CUF, MUF, NCF/NCP) that meet strict design rules and high-density packaging requirements, ensuring stable, cost-effective, and scalable technology delivery according to the technology roadmap.


• Advanced Underfill Process development for CoWoS PKG product family and CPO


• Dispensing & Material Evaluation / Qualification


• Void & Fillet Control


• Failure Analysis & Reliability Enhancement


• Customer Development & Technology Transfer


• Lead assigned projects


• Yield Improvement & Yield Failure Analysis (FA)

Required Experience and Qualifications:

• Bachelor’s degree or higher in engineering or science (e.g., Material Science, Chemistry, Chemical Engineering, Electronics, Advanced Materials, etc.)


• R&D or mass production experience of at least three years in Underfill processes (e.g., CUF, MUF, NCF/NCP), dispensing, or encapsulation technology


• Proven experience in driving customer development programs (e.g., JDP, customer qualification, technical evaluations) and managing customer requirements


• Fundamental understanding of advanced semiconductor packaging processes, underfill fluid dynamics, void-free encapsulation, and thermal-mechanical stress control


• Strong skills in experimental design (DoE), failure analysis (FA), and technical data reporting


• Ability to prepare technical documents and deliver presentations to internal and external stakeholders


• Proficiency in reading and writing technical documents in English


• Basic knowledge of underfill equipment (dispenser, cure oven), epoxy/resin materials, and inspection/reliability characterization tools


• Salary up to $6000


• Location: Yishun


• Mon To Fri 8am -518pm

JOB ID: JOB-00882

All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.