Senior Research Fellow [Thermo-Mechanical Simulation]

NATIONAL UNIVERSITY OF SINGAPORE; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

The ECE Department at NATIONAL UNIVERSITY OF SINGAPORE is seeking a Senior Research Fellow. We require an experienced Thermo-Mechanical and Thermal Simulation Researcher to drive modeling and simulation for next-generation semiconductor packaging, including 2.5D, 3D, chiplet, and heterogeneous integration.

The role involves leading a module team, developing FE models, and correlating results with reliability data.

Qualifications

• PhD preferred in engineering or physics; exceptional candidates with a Master’s degree and strong industry background may be considered.
• 3+ years of industrial R&D or advanced research in semiconductor packaging, thermal engineering, reliability, or related fields.
• Experience in thermo-mechanical and thermal simulation of advanced electronic packages; publications are a plus.

Responsibilities

• Develop and execute FE/multiphysics simulations to evaluate thermal/mechanical behavior of advanced packages.
• Establish predictive reliability models and correlate with experimental data.
• Lead research on 2.5D/3D packaging, chiplet integration, and heterogeneous integration.
• Drive design recommendations based on simulation insights and contribute to IP and publications.
• Collaborate with academia, industry partners, and government-sponsored institutes.

Skills

Thermo-mechanical modeling

Finite element analysis

Reliability engineering

AI/HP packaging knowledge

Multiphysics modeling

Scripting (Python, MATLAB)

Education

PhD in Engineering/Physics or equivalent

Master plus substantial industry experience

Tools

ANSYS Mechanical

ANSYS Icepak

COMSOL Multiphysics

Abaqus

Python

MATLAB

Job description

Job Description

The ECE Department at NUS is seeking a Senior Research Fellow. An experienced and highly motivated Thermo-Mechanical and Thermal Simulation Researcher to drive the development and deployment of advanced modeling and simulation methodologies for next-generation semiconductor packaging technologies, including Integrated Silicon Photonics solutions. The successful candidate will play a key role in supporting 2.5D, 3D, chiplet, and heterogeneous integration programs through predictive simulation of thermo-mechanical behavior, package reliability, and manufacturing process interactions.

The successful candidate will play a dual role: In spearheading the development of advanced 2.5D, 3D, chiplet, and heterogeneous integration programs, while driving innovation and validation of next-generation technologies to enable industry-leading system scaling.

This position offers a unique opportunity to conduct cutting-edge research in thermal, mechanical, and reliability modeling, enabling the development of advanced packaging solutions for AI, HPC, datacenter, and communication applications. The researcher will work closely with leading academic researchers, industrial partners, and government-sponsored research institutions advance the scientific understanding of thermo-mechanical interactions, high-power thermal management and reliability challenges in advanced packaging systems.

Responsibilities will involve:

1. Thermal and Thermo-Mechanical Modeling.

Develop and execute finite element simulations (FEA) and multiphysics models to evaluate thermal and mechanical behavior of advanced semiconductor packages.
Analyze package-level and system-level thermal performance, including heat dissipation, thermal resistance, temperature distribution, and cooling strategies.
Model thermo-mechanical stresses arising from coefficient of thermal expansion (CTE) mismatch, package warpage, and assembly processes.
Investigate deformation mechanisms associated with die stacking, TSV integration, hybrid bonding, underfill materials, interposers, and advanced substrate technologies.
Provide design recommendations based on simulation-driven insights.

2. Reliability Assessment

Establish predictive models for package reliability, including Thermal cycling, Power cycling, Solder fatigue, Die cracking, Interfacial delamination and Interconnect reliability.
Correlate simulation results with experimental reliability test data and failure analysis findings.

3. Research and Innovation

Develop simulation methodologies for advanced packaging challenges associated with AI accelerators, high-power processors, and heterogeneous integration.
Evaluate emerging packaging technologies such as 3D IC stacking, Chiplet integration, Silicon interposers, Hybrid bonding, Advanced cooling solutions, Embedded bridges, and fan-out architecture.
Generate intellectual property through patent disclosures and technical publications.

4. Leadership Impact

Lead a critical module team to enable leadership system integration technology for 2.5D and 3D/hybrid bonding systems.
Expanded Project Management: Acting as the primary technical interface and taking full ownership of deliverables.
A key role in enabling the next generation of advanced packaging technologies through predictive simulation, reliability engineering, and innovative research. Your work will directly influence the development of future AI, HPC, datacentre, and heterogeneous integration platforms.

5. Key Research Areas

• Thermo-mechanical modeling of hybrid bonded structures
• AI/HPC package thermal management and advanced cooling solution design
• Chiplet/package co-design optimization
• Warpage prediction and control
• Physics-based reliability prediction

Job Requirements

Education

• Reporting to PI Prof Yu Chen-Hua.
• Ph.D. in Electrical, Electronics, Mechanical, Chemical Engineering, Computational Engineering, Applied Physics, Material Science or its equivalent from a reputable University/Institute is preferred.
• Exceptional candidates with a Master's degree and significant industry experience will also be considered.

Experience

• 3+ years of industrial R&D, or advanced research and development experience in semiconductor packaging, thermal engineering, reliability, or related fields.
• Candidate demonstrated experience in thermo-mechanical and thermal simulation of advanced electronic packages. Publication records in peer-reviewed journals and international conferences in advanced packaging or Silicon photonics will be a big plus.

Technical Skills

• Strong analytical and problem-solving skills with solid knowledge of Solid mechanics, Fracture mechanics, Heat transfer, Reliability physics and Finite element analysis.
• Hands-on experience with simulation tools such as ANSYS Mechanical, ANSYS Icepak, COMSOL Multiphysics, Abaqus or equivalent FEA platforms.
• Familiarity with 2.5D/3D packaging, Chiplet integration, Hybrid bonding, TSV technologies, and Silicon Photonics.
• Experience with scripting and automation using Python, MATLAB, or similar programming languages will be a big plus.

Others

• Proficiency in data analysis and interpretation using statistical tools and software packages.
• Excellent communication skills and the ability to work effectively in a collaborative research environment.
• Motivated and possesses effective communication skills including writing and presenting.
• Ability to present complex technical concepts to multidisciplinary audiences.
• Open to Fixed Term Contract.

We regret that only shortlisted candidates will be notified.