Research Fellow [Thermo-Mechanical Simulation]

National University of Singapore; Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

The National University of Singapore’s ECE Department seeks a Research Fellow to drive thermo-mechanical and thermal simulation research for next-generation semiconductor packaging, including 2.5D/3D integration and Silicon Photonics.

The role focuses on predictive simulation of thermo-mechanical behavior and reliability, collaborating with industry partners to advance packaging technologies for AI and HPC applications.

Qualifications

• PhD in a relevant engineering/physics field is preferred.
• 3+ years of industrial R&D or advanced research in semiconductor packaging, thermal engineering, or reliability.

Responsibilities

• Develop and execute finite element simulations (FEA) to evaluate thermal and mechanical behavior of advanced semiconductor packages.
• Model thermo-mechanical stresses from CTE mismatch, warpage, and assembly processes.
• Establish predictive models for package reliability and correlate with experimental data.
• Publish findings and generate IP through patents and publications.

Skills

Solid mechanics

Fracture mechanics

Heat transfer

Finite element analysis

Python

MATLAB

Analytical thinking

Communication skills

Education

PhD in Electrical, Electronics, Mechanical, Chemical Engineering, Computational Engineering, Applied Physics, Materials Science or equivalent

Tools

ANSYS Mechanical

ANSYS Icepak

COMSOL Multiphysics

Abaqus

Job description

Company description

The National University of Singapore is the national research university of Singapore. Founded in 1905 as the Straits Settlements and the Federated Malay States Government Medical School, NUS is the oldest higher education institution in Singapore

Job description

The ECE Department at NUS is seeking a Research Fellow. An experienced and highly motivated Thermo-Mechanical and Thermal Simulation Researcher to drive the development and deployment of advanced modeling and simulation methodologies for next-generation semiconductor packaging technologies, including Integrated Silicon Photonics solutions. The successful candidate will play a key role in supporting 2.5D, 3D, chiplet, and heterogeneous integration programs through predictive simulation of thermo-mechanical behavior, package reliability, and manufacturing process interactions.

This position offers a unique opportunity to conduct cutting-edge research in thermal, mechanical, and reliability modeling, enabling the development of advanced packaging solutions for AI, HPC, datacenter, and communication applications. The researcher will work closely with leading academic researchers, and industrial partners advance the scientific understanding of thermo-mechanical interactions, high-power thermal management and reliability challenges in advanced packaging systems.

Responsibilities will involve

1. Thermal and Thermo-Mechanical Modeling

• Develop and execute finite element simulations (FEA) and multiphysics models to evaluate thermal and mechanical behavior of advanced semiconductor packages.
• Analyze package-level and system-level thermal performance, including heat dissipation, thermal resistance, temperature distribution, and cooling strategies.
• Model thermo-mechanical stresses arising from coefficient of thermal expansion (CTE) mismatch, package warpage, and assembly processes.
• Investigate deformation mechanisms associated with die stacking, TSV integration, hybrid bonding, underfill materials, interposers, and advanced substrate technologies.
• Provide design recommendations based on simulation-driven insights.

2. Reliability Assessment

• Establish predictive models for package reliability, including Thermal cycling, Power cycling, Solder fatigue, Die cracking, Interfacial delamination and Interconnect reliability.
• Correlate simulation results with experimental reliability test data and failure analysis findings.

3. Research and Innovation

• Develop simulation methodologies for advanced packaging challenges associated with AI accelerators, high-power processors, and heterogeneous integration.
• Evaluate emerging packaging technologies such as 3D IC stacking, Chiplet integration, Silicon interposers, Hybrid bonding, Advanced cooling solutions, Embedded bridges, and fan-out architecture.
• Generate intellectual property through patent disclosures and technical publications.

4. Impact

• System integration technology for 2.5D and 3D/hybrid bonding systems.
• Expanded Project Management: Acting as the primary technical interface and taking full ownership of deliverables.
• A key role in enabling the next generation of advanced packaging technologies through predictive simulation, reliability engineering, and innovative research. Your work will directly influence the development of future AI, HPC, datacentre, and heterogeneous integration platforms.

5. Key Research Areas

• Thermo-mechanical modeling of hybrid bonded structures
• AI/HPC package thermal management and advanced cooling solution design
• Chiplet/package co-design optimization
• Warpage prediction and control
• Physics-based

Job Requirements

Education

• Reporting to PI Prof Yu Chen-Hua.
• Ph.D. in Electrical, Electronics, Mechanical, Chemical Engineering, Computational Engineering, Applied Physics, Material Science or its equivalent from a reputable University/Institute is preferred.

Experience

• 3+ years of industrial R&D, or advanced research and development experience in semiconductor packaging, thermal engineering, reliability, or related fields.
• Candidate demonstrated experience in thermo-mechanical and thermal simulation of advanced electronic packages. Publication records in peer-reviewed journals and international conferences in advanced packaging or Silicon photonics will be a big plus.

Technical Skills

• Strong analytical and problem-solving skills with solid knowledge of Solid mechanics, Fracture mechanics, Heat transfer, Reliability physics and Finite element analysis.
• Hands-on experience with simulation tools such as ANSYS Mechanical, ANSYS Icepak, COMSOL Multiphysics, Abaqus or equivalent FEA platforms.
• Familiarity with 2.5D/3D packaging, Chiplet integration, Hybrid bonding, TSV technologies, and Silicon Photonics.
• Experience with scripting and automation using Python, MATLAB, or similar programming languages will be a big plus.

Others

• Proficiency in data analysis and interpretation using statistical tools and software packages.
• Excellent communication skills and the ability to work effectively in a collaborative research environment.
• Motivated and possesses effective communication skills including writing and presenting.
• Ability to present complex technical concepts to multidisciplinary audiences.

Open to Fixed Term Contract.