Thermal and Mechanical Program Lead for HPC Systems

AMD; Singapore; Hybrid; SGD 120,000 - 180,000; Full time

Benefits offered by this job

AMD benefits

Job summary

AMD is seeking an experienced engineer to lead thermal, mechanical and advanced board-assembly development programs from requirements through builds, qualification and ramp. You will connect package, board, cooling and chassis to support the product schedule, with regional travel to supplier sites and engineering builds.

As an individual contributor you will influence decisions across global engineering, manufacturing and suppliers without direct authority, communicating clearly with engineers

Qualifications

• Experience leading cross-functional technical programs in thermal/mechanical hardware or electronics packaging.
• Delivery from engineering development through qualification and production ramp.
• Knowledge of SMT and large BGA assembly challenges (warpage, coplanarity, solder-joint integrity).

Responsibilities

• Define program scope, milestones, owners and acceptance criteria with integrated schedules.
• Coordinate package, board and chassis interfaces, including thermal and assembly requirements.
• Lead reviews with cooling suppliers, CMs, ODMs and OSATs, tracking specs and tooling.
• Plan engineering and validation builds and drive decisions at milestones.
• Coordinate deliverables for advanced SMT and large BGA assembly, including yield and rework.
• Manage risks and changes, presenting options with schedule and cost impact.
• Drive DFM/DFA reviews and manufacturing handover.

Skills

Thermal hardware

Electronic packaging

NPI program management

Cross-functional leadership

Technical communication

Education

Bachelor's degree in Mechanical/Electrical Engineering

Tools

Power BI

SQL

Python

Job description

AMD is seeking an experienced engineer to lead thermal, mechanical and advanced board-assembly development programs from requirements through builds, qualification and ramp. You will connect package, board, cooling and chassis to support the product schedule, with regional travel to supplier sites and engineering builds.

As an individual contributor you will influence decisions across global engineering, manufacturing and suppliers without direct authority, communicating clearly with engineers