Senior Manager, Thermal Packaging & NPI Readiness

Advanced Micro Devices, Inc.

Singapore

On-site

SGD 180,000 - 240,000

Full time

4 days ago

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Benefits offered by this job

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Job summary

Advanced Micro Devices, Inc. (AMD) is seeking a senior leader to manage external manufacturing operations for backend engineering in Singapore.

You will drive supplier engagement for thermal cooling solutions, oversee NPI readiness, and push for high-volume production execution while developing a geographically distributed engineering team. The role requires hands-on leadership, strong technical judgement, and excellent cross-functional collaboration to deliver results in a fast-paced

Qualifications

Bachelor's or Master's degree in Mechanical Engineering, Materials Science, Chemical Engineering or Manufacturing Engineering.
Hands-on people leadership with strong technical judgement and problem-solving.
Experience in semiconductor backend or high-volume supplier operations is preferred.

Responsibilities

Lead supplier engagement for thermal cooling solutions and related processes.
Plan and drive New Product Introduction, qualification and ramp readiness.
Drive supplier manufacturing readiness through PFMEA, control plans, equipment readiness and monitoring.
Lead and develop engineers by setting goals and expectations while building depth.
Align cross-functional teams and provide concise data-based updates to management.