Global Thermal & Mechanical Engineering Program Lead

Advanced Micro Devices (S) Pte Ltd; Singapore; Hybride; SGD 110 000 - 190 000; Plein temps

Résumé du poste

Advanced Micro Devices (S) Pte Ltd in Singapore seeks an experienced engineer to lead thermal, mechanical and board-assembly programs from requirements through ramp. You will connect package, board, cooling and chassis interfaces to align engineering and supplier deliverables with the product schedule, including regional travel to supplier sites.

The role requires strong technical depth, cross-functional collaboration, and clear communication with engineers and executives worldwide.

Qualifications

• Substantial experience in thermal/mechanical hardware, electronic packaging or electronics NPI, including leading complex cross-functional technical programs.
• Proven delivery from engineering development through qualification and production ramp.
• Working knowledge of SMT processes and large BGA assembly challenges (warpage, coplanarity, solder-joint integrity) is advantageous.
• Understanding of the package-to-system heat path, TIMs, tolerance stack-ups, shock/vibration and board-level reliability qualification is advantageous.
• Experience managing cooling suppliers, CMs, ODMs or OSATs, preferably in the Asia-Pacific region is advantageous.
• Experience with DOE, root-cause analysis (8D, FMEA) and phase-gate program management is advantageous.
• Proficient in English, technical writing and executive communication skills.
• High-performance computing, GPU or server programs; liquid/air cooling products; PMP or equivalent; Power BI, SQL or Python is advantageous.

Responsabilités

• Define program scope, milestones, owners and acceptance criteria.
• Build integrated schedules and manage critical paths, resources and budgets.
• Coordinate package, board and chassis interfaces, including thermal, power, mechanical and assembly requirements.
• Lead execution reviews with cooling suppliers, CMs, ODMs and OSATs and monitor specs, samples, tooling and capacity.
• Plan engineering and validation builds and drive entry/exit decisions at milestones.
• Coordinate deliverables for advanced SMT and large BGA assembly, including process windows and warpage mitigation.
• Manage risks, issues, dependencies and engineering changes; present recovery options with cost and qualification impact.

Connaissances

Thermal HW

Mechanical

Electronic packaging

NPI program

Cross-functional

DOE/8D/FMEA

PMP

Power BI

SQL

Python

Formation

Bachelor's degree in Mechanical, Materials, Manufacturing, Electrical or Electronics Engineering

Outils

Power BI

SQL

Python

Description du poste

Advanced Micro Devices (S) Pte Ltd in Singapore seeks an experienced engineer to lead thermal, mechanical and board-assembly programs from requirements through ramp. You will connect package, board, cooling and chassis interfaces to align engineering and supplier deliverables with the product schedule, including regional travel to supplier sites.

The role requires strong technical depth, cross-functional collaboration, and clear communication with engineers and executives worldwide.