Technical Program Manager, Thermal & Mechanical Engineering

XILINX ASIA PACIFIC PTE. LTD.; Singapore; On-site; SGD 120,000 - 160,000; Full time

Job summary

XILINX ASIA PACIFIC PTE. LTD. is seeking an experienced hardware/packaging program manager to lead thermal, mechanical, and advanced board-assembly development from requirements through engineering builds, qualification, and ramp.

The role involves coordinating interfaces across package, board, cooling, and chassis while engaging suppliers to meet the product schedule. You will drive evidence-based decisions, manage risks, and communicate with engineers and executives across global teams,

Qualifications

• Bachelor’s degree in Mechanical, Materials, Manufacturing, Electrical or Electronics Engineering.
• Experience leading cross-functional hardware/NPI programs in Asia-Pacific.
• Knowledge of SMT and BGA assembly processes.

Responsibilities

• Define program scope, milestones, owners and acceptance criteria. Build integrated schedules and manage critical paths, resources and budgets.
• Coordinate package, board and chassis interfaces, including thermal, power, mechanical and assembly requirements, and assess the impact of design changes.
• Lead execution reviews with cooling suppliers, CMs, ODMs and OSATs. Track specifications, samples, tooling, capacity, quality and recovery actions.
• Plan engineering and validation builds, and drive evidence-based entry and exit decisions at each milestone.
• Coordinate program deliverables for advanced SMT and large BGA assembly, including process windows, warpage mitigation, defect reduction, edge bond/underfill and BGA rework, with the responsible engineers.
• Manage risks, issues, dependencies and engineering changes. Present recovery options with schedule, cost and qualification impact to decision-makers.
• Drive DFM/DFA reviews, release documentation, manufacturing handover, ramp issue closure and lessons learned.

Skills

Program management

Cross-functional collaboration

Technical depth

Executive communication

Risk assessment

Education

Bachelor’s degree in Mechanical, Materials, Manufacturing, Electrical or Electronics Engineering

Tools

Power BI

SQL

Python

Job description

THE ROLE:

You will lead thermal, mechanical and advanced board-assembly development programs from requirements through engineering builds, qualification, manufacturing release and production ramp. You will connect package, board, cooling and chassis integration to make sure engineering and supplier deliverables support the product schedule. The role includes regional travel to supplier sites and engineering builds.

THE PERSON:

You are an individual contributor who drives decisions across global engineering, manufacturing and supplier teams without direct authority. You have enough technical depth to challenge assumptions and assess risk, while engineering owners keep design approval. You communicate clearly with engineers and executives alike.

KEY RESPONSIBILITIES:

• Define program scope, milestones, owners and acceptance criteria. Build integrated schedules and manage critical paths, resources and budgets.


• Coordinate package, board and chassis interfaces, including thermal, power, mechanical and assembly requirements, and assess the impact of design changes.


• Lead execution reviews with cooling suppliers, CMs, ODMs and OSATs. Track specifications, samples, tooling, capacity, quality and recovery actions.


• Plan engineering and validation builds, and drive evidence-based entry and exit decisions at each milestone.


• Coordinate program deliverables for advanced SMT and large BGA assembly, including process windows, warpage mitigation, defect reduction, edge bond/underfill and BGA rework, with the responsible engineers.


• Manage risks, issues, dependencies and engineering changes. Present recovery options with schedule, cost and qualification impact to decision-makers.


• Drive DFM/DFA reviews, release documentation, manufacturing handover, ramp issue closure and lessons learned.

PREFERRED EXPERIENCE:

• Substantial experience in thermal/mechanical hardware, electronic packaging or electronics NPI, including leading complex cross-functional technical programs.


• Proven delivery from engineering development through qualification and production ramp.


• Working knowledge of SMT processes and large BGA assembly challenges (warpage, coplanarity, solder-joint integrity) is advantageous.


• Understanding of the package-to-system heat path, TIMs, tolerance stack-ups, shock/vibration and board-level reliability qualification is advantageous.


• Experience managing cooling suppliers, CMs, ODMs or OSATs, preferably in the Asia-Pacific region is advantageous.


• Experience with DOE, root-cause analysis (8D, FMEA) and phase-gate program management is advantageous.


• Proficient in English, technical writing and executive communication skills.


• High-performance computing, GPU or server programs; liquid/air cooling products; PMP or equivalent; Power BI, SQL or Python is advantageous.

ACADEMIC CREDENTIALS:

• Bachelor's degree in Mechanical, Materials, Manufacturing, Electrical or Electronics Engineering, or a related discipline. Equivalent directly relevant experience may be considered.

LOCATION:

Singapore