Global TPM: Thermal & Mechanical Hardware Programs Lead

Advanced Micro Devices, Inc.; Singapore; Presencial; SGD 120.000 - 180.000; Jornada completa

Ventajas ofrecidas por este puesto de trabajo

AMD benefits at a glance

Descripción de la vacante

Advanced Micro Devices, Inc. (AMD) in Singapore seeks an experienced program lead for thermal, mechanical and advanced board-assembly development from requirements to production ramp.

You will connect package, board, cooling and chassis integration to support schedules and engage suppliers globally. You will drive integrated schedules, coordinate interfaces, and manage risks with engineering and manufacturing teams, delivering evidence-based decisions at each milestone while ensuring DOT/DP

Formación

• Substantial experience in thermal/mechanical hardware, electronic packaging or electronics NPI, including leading complex cross-functional technical programs.
• Proven delivery from engineering development through qualification and production ramp.
• Working knowledge of SMT processes and large BGA assembly challenges (warpage, coplanarity, solder-joint integrity) is advantageous.
• Understanding of the package-to-system heat path, TIMs, tolerance stack-ups, shock/vibration and board-level reliability qualification is advantageous.
• Experience managing cooling suppliers, CMs, ODMs or OSATs, preferably in the Asia-Pacific region is advantageous.
• Experience with DOE, root-cause analysis (8D, FMEA) and phase-gate program management is advantageous.
• Proficient in English, technical writing and executive communication skills.
• High-performance computing, GPU or server programs; liquid/air cooling products; PMP or equivalent; Power BI, SQL or Python is advantageous.

Responsabilidades

• Define program scope, milestones, owners and acceptance criteria. Build integrated schedules and manage critical paths, resources and budgets.
• Coordinate package, board and chassis interfaces, including thermal, power, mechanical and assembly requirements, and assess the impact of design changes.
• Lead execution reviews with cooling suppliers, CMs, ODMs and OSATs. Track specifications, samples, tooling, capacity, quality and recovery actions.
• Plan engineering and validation builds, and drive evidence-based entry and exit decisions at each milestone.
• Coordinate program deliverables for advanced SMT and large BGA assembly, including process windows, warpage mitigation, defect reduction, edge bond/underfill and BGA rework, with the responsible engineers.
• Manage risks, issues, dependencies and engineering changes. Present recovery options with schedule, cost and qualification impact to decision-makers.
• Drive DFM/DFA reviews, release documentation, manufacturing handover, ramp issue closure and lessons learned.

Conocimientos

Thermal/Mechanical hardware

Electronic packaging

NPI program management

English communication

Educación

Bachelor's degree in Engineering

Herramientas

Power BI

SQL

Python

Descripción del empleo

Advanced Micro Devices, Inc. (AMD) in Singapore seeks an experienced program lead for thermal, mechanical and advanced board-assembly development from requirements to production ramp.

You will connect package, board, cooling and chassis integration to support schedules and engage suppliers globally. You will drive integrated schedules, coordinate interfaces, and manage risks with engineering and manufacturing teams, delivering evidence-based decisions at each milestone while ensuring DOT/DP