Technical Program Manager

Citadel Search; Singapore; On-site; SGD 120,000 - 200,000; Full time

Job summary

Citadel Search is seeking an experienced Technical Program Manager to lead multi-disciplinary engineering programs in a high-tech manufacturing environment. You will drive New Product Introduction (NPI), factory bring-up, and process optimisation across the full lifecycle from prototype to high-volume manufacturing.

The role requires strong leadership, cross‑functional coordination, and hands‑on knowledge of semiconductor packaging processes to deliver robust NPI handoffs and continuous

Qualifications

• Bachelor’s degree in Mechanical, Electrical or Manufacturing Engineering.
• 8+ years in electronics, semiconductor, or optical module manufacturing.
• 5+ years in technical program management within high-volume environments.
• Experience with optical module or datacom manufacturing preferred.
• Strong risk identification and mitigation for supply, equipment, and dependencies.

Responsibilities

• Lead the full technical program lifecycle for new product introductions in a manufacturing facility.
• Coordinate milestones across design, process engineering and production teams.
• Apply hands-on knowledge of semiconductor packaging processes to translate specs into manufacturing flows.
• Mitigate cross-functional risks and ensure timely NPI handoffs to the factory floor.
• Improve FPY and investigate root causes of manufacturing failures.
• Define and improve engineering development processes, metrics, and dashboards.

Skills

Leadership

Cross-functional coordination

Stakeholder management

Communication

Education

Bachelor’s degree in Mechanical/Electrical/Manufacturing Engineering

Job description

We are looking for an experienced Technical Program Manager (TPM) who will be responsible for leading and executing multi-disciplinary engineering programs for a high-tech manufacturing environment. In this role, you will drive New Product Introduction (NPI), factory bring-up activities, process optimisation, and technical risk mitigation across the full manufacturing lifecycle, from prototype through to high-volume manufacturing (HVM).

Job Responsibilities

• Lead the full technical program lifecycle for introducing new products into the manufacturing facility, coordinating milestones across product design, process engineering, and production teams
• Apply hands‑on knowledge of critical semiconductor packaging processes — including Die Bonding, Wire Bonding, and Active Alignment — to partner with engineering teams, translate technical specifications into manufacturing flows, and ensure smooth NPI handoffs to the factory floor
• Proactively identify and mitigate cross‑functional risks affecting production timelines, including component shortages (lasers, photodetectors, ICs) and equipment delays
• Collaborate with quality and engineering teams to address technical bottlenecks, improve first‑pass yield (FPY), and conduct root‑cause analysis on manufacturing failures
• Define, implement, and continuously improve engineering development processes, communication frameworks, and metrics tracking covering velocity, quality, capacity, and manufacturing yield
• Manage cross‑team dependencies, facilitate technical trade‑off decisions under constraint, and maintain program dashboards to communicate timeline progress and critical path updates
• Champion operational excellence through standardisation across design, test, and production teams

Job Requirements

• Bachelor’s degree or above in Mechanical Engineering, Electrical Engineering, Manufacturing Engineering, or a related discipline
• More than 8 years of experience in electronics, semiconductor, or optical module manufacturing
• More than 5 years in technical program management, engineering management, or technical project leadership within high‑volume manufacturing environments
• Experience in optical module or datacom manufacturing is preferred
• Experience identifying and mitigating risks related to component supply, equipment readiness, and cross‑functional dependencies
• Strong understanding of semiconductormanufacturing processes, including SMT/PCBA, Die Bond, Wire Bond, Active Alignment, Assembly, Test, and Burn‑in
• Proven ability to manage NPI programs from prototype stage through to high‑volume manufacturing
• Understanding of cost modelling, BOM structure, capacity planning, and line readiness
• Strong leadership and cross‑functional coordination skills, with experience managing program dashboards and reporting
• Possess a background in process standardisation and operational excellence initiatives across engineering and production teams
• Familiarity with manufacturing metrics and quality frameworks, including FPY tracking, root‑cause analysis, and yield improvement methodologies
• Excellent communication skills with the ability to engage both internal stakeholders and external customers

See the impact we’ve made at our Engineering Desk to view the engineering roles we’ve successfully filled for professionals like you.