Research Scientist: TBDB Process Modules for 3D Packaging

A*STAR RESEARCH ENTITIES; Singapore; In loco; SGD 120.000 - 180.000; Tempo pieno

Descrizione del lavoro

A*STAR RESEARCH ENTITIES in Singapore is seeking a Research Scientist to develop temporary wafer bonding and debonding (TBDB) technologies for next-generation semiconductor packaging. You will join a multidisciplinary team turning research ideas into robust manufacturing solutions for 3D ICs, chiplets, and wafer-level packaging.

The role emphasizes hands-on process development in a cleanroom, DOE-driven optimization, and collaboration across design, integration, equipment, and reliability teams,

Competenze

• Ph.D. in a related field with 5+ years of experience.
• Hands-on semiconductor process development in a cleanroom environment.
• Experience in temporary bonding, wafer bonding, advanced packaging, or thin-wafer processing preferred; new Ph.D. grads welcome.

Mansioni

• Develop and optimize temporary wafer bonding and debonding processes for advanced semiconductor packaging.
• Design and execute DOE to improve process capability, yield, and reliability.
• Develop solutions for thin-wafer handling, layer transfer, debonding, cleaning, and warpage control.
• Investigate process challenges via root-cause analysis and implement corrective actions.
• Collaborate with design, integration, equipment, and reliability teams to develop robust process solutions.
• Collaborate with vendors to evaluate and qualify new bonding materials, carrier systems, and equipment.
• Perform wafer characterization using advanced metrology and failure analysis techniques.
• Analyse process data, establish process control methods, and document technical results.
• Contribute to technology innovation through patents, publications, and collaboration with internal and external partners.

Conoscenze

Analytical skills

Problem-solving

DOE

Formazione

Ph.D. in Materials Science / Engineering / Physics / Chemistry or related field

Strumenti

Wafer bonding equipment

Descrizione del lavoro

A*STAR RESEARCH ENTITIES in Singapore is seeking a Research Scientist to develop temporary wafer bonding and debonding (TBDB) technologies for next-generation semiconductor packaging. You will join a multidisciplinary team turning research ideas into robust manufacturing solutions for 3D ICs, chiplets, and wafer-level packaging.

The role emphasizes hands-on process development in a cleanroom, DOE-driven optimization, and collaboration across design, integration, equipment, and reliability teams,