Get a reply from this employer
Your resume and cover letter, tailored to exactly what they’re hiring for.
Micron Technology, Inc. in Singapore is seeking a Package Pathfinding Architect to define next-generation memory packaging and system architectures, optimizing speed, bandwidth, power, and thermal performance.
You will lead cross-stack co-optimization across silicon, package, board, and system, partner with customers, and guide long-term roadmaps while interfacing with design teams. This role emphasizes AI-enabled tooling and data-driven decision making across engineering, operations, and
Micron Technology, Inc. in Singapore is seeking a Package Pathfinding Architect to define next-generation memory packaging and system architectures, optimizing speed, bandwidth, power, and thermal performance.
You will lead cross-stack co-optimization across silicon, package, board, and system, partner with customers, and guide long-term roadmaps while interfacing with design teams. This role emphasizes AI-enabled tooling and data-driven decision making across engineering, operations, and