Memory Packaging Pathfinding Architect

Micron; Singapore; On-site; SGD 150,000 - 210,000; Full time

Job summary

Micron Technology, Inc. is seeking a Package Pathfinding Architect to define next‑generation memory packaging architectures from data center to edge‑AI.

You will lead cross‑stack optimization across silicon, package, board, and system, and influence long‑term technology roadmaps with customers and internal partners. The role requires deep memory timing knowledge, hands‑on experience with EDA tools, and a track record in package design and AI‑enabled engineering.

Qualifications

• Master’s degree or equivalent degree and industry experience in EE, CE, CS, or related field.
• At least 5 years of relevant industry experience in package design, electrical simulations and tools like Ansys, Siemens and Cadence.
• Extensive hands‑on experience in memory systems package design, signaling, IO design, PDN design.
• Deep understanding of memory timing, signaling, power, package process technology working knowledge of EDA tools for design, analysis and simulation of electronic packaging, including but not limited to Cadence, Siemens and Ansys tools.
• Experience applying AI or LLMs for engineering efficiency.

Responsibilities

• Define next‑generation package pathfinding and system architectures optimizing for speed performance, system bandwidth, power, capacity, thermal, mechanical and electrical performance.
• Lead cross‑stack co‑optimization across silicon, package, board, and system with package centric solutions approach.
• Drive long‑term memory technology packaging strategy and influence industry standards.
• Work closely with silicon, and system design teams and customers for next generation and long term disruptive solutions to boost speed performance for edge‑AI and datacenter memory products.
• Serve as a technical interface to internal partners, customers, BUs, senior leaders.

Skills

Package design

Electrical simulations

Memory systems architecture

AI/LLMs for engineering efficiency

Education

Master’s degree in EE/CE/CS

PhD in related field

Tools

Ansys

Siemens

Cadence

Python

MATLAB

Job description

Micron Technology, Inc. is seeking a Package Pathfinding Architect to define next‑generation memory packaging architectures from data center to edge‑AI.

You will lead cross‑stack optimization across silicon, package, board, and system, and influence long‑term technology roadmaps with customers and internal partners. The role requires deep memory timing knowledge, hands‑on experience with EDA tools, and a track record in package design and AI‑enabled engineering.